XC3S5000-4FGG1156I
XC3S5000-4FGG1156I
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rohs

AMD Xilinx

XC3S5000-4FGG1156I


XC3S5000-4FGG1156I
F20-XC3S5000-4FGG1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 35 X 35 MM, LEAD FREE, FBGA-1156
35 X 35 MM, LEAD FREE, FBGA-1156

XC3S5000-4FGG1156I ECAD Model


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XC3S5000-4FGG1156I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 784
Number of Outputs 784
Number of Logic Cells 74880
Number of Equivalent Gates 5000000
Number of CLBs 8320
Combinatorial Delay of a CLB-Max 610 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 8320 CLBS, 5000000 GATES
Clock Frequency-Max 630 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 35 X 35 MM, LEAD FREE, FBGA-1156
Pin Count 1156

XC3S5000-4FGG1156I Datasheet Download


XC3S5000-4FGG1156I Overview



The XC3S5000-4FGG1156I is a powerful chip model that is suitable for a wide range of applications in the digital signal processing, embedded processing, and image processing industries. It is designed to be an all-in-one solution for these industries, offering a high performance processor with the ability to use the HDL language for programming.


The XC3S5000-4FGG1156I has several advantages that make it an attractive option for these industries. It offers a high-performance processor that is capable of handling complex tasks, as well as the ability to use the HDL language for programming. This makes it easier for developers to create their own custom applications using the chip, as well as allowing them to modify existing applications. Additionally, the chip model is designed to be energy-efficient, allowing it to run longer without needing to be recharged.


The expected demand for the XC3S5000-4FGG1156I in the digital signal processing, embedded processing, and image processing industries is likely to remain strong in the future. This is due to the chip’s capabilities, as well as its energy efficiency. Additionally, the chip model is designed to be able to be upgraded in the future, allowing developers to add new features and capabilities as needed.


The original design intention of the XC3S5000-4FGG1156I was to provide a powerful and energy-efficient processor for these industries. It was also designed to be able to use the HDL language for programming, making it easier for developers to create their own applications. Additionally, the chip model was designed with the possibility of future upgrades in mind, allowing developers to add new features and capabilities as needed.


The XC3S5000-4FGG1156I is also capable of being used in advanced communication systems. This is due to its high-performance processor, as well as its ability to use the HDL language for programming. Additionally, the chip model was designed with the possibility of future upgrades in mind, allowing developers to add new features and capabilities as needed. This makes the XC3S5000-4FGG1156I an attractive option for advanced communication systems, as it is capable of handling the complex tasks required for these systems.



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Unit Price: $118.08
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Pricing (USD)

QTY Unit Price Ext Price
1+ $109.8144 $109.8144
10+ $108.6336 $1,086.3360
100+ $102.7296 $10,272.9600
1000+ $96.8256 $48,412.8000
10000+ $88.5600 $88,560.0000
The price is for reference only, please refer to the actual quotation!

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