XC3S5000-4FGG1156C

The XC3S5000-4FGG1156C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range FPGA with a wide range of features and specifications.

The XC3S5000-4FGG1156C chip has a capacity of 5 million system gates and offers up to 4,096 logic cells. It has up to 6,800 Kbits of distributed RAM and up to 1,152 Kbits of block RAM. It also has up to 4,096 flip-flops, up to 256 multipliers, up to 156 user I/O pins, up to 32 DSP slices, and up to 4 clock management tiles. The chip has a maximum power consumption of 10.8W and a maximum operating temperature of 105°C. It is available in a 11 x 11 mm, 156-pin, Flip-Chip Ball Grid Array (FCBGA) package.

The XC3S5000-4FGG1156C chip is designed for a wide range of applications including industrial automation, medical devices, consumer electronics, automotive, aerospace, and communication systems. It can be used for data acquisition and control systems, image processing, video and audio processing, signal processing, and Ethernet-based systems. It also supports a wide range of peripherals and interfaces such as USB, RS232, SPI, I2C, and CAN.

In conclusion, the XC3S5000-4FGG1156C is a mid-range FPGA chip with a wide range of features and specifications. It is suitable for a wide range of applications and supports a wide range of peripherals and interfaces.