XC3S5000-4FGG1153C
XC3S5000-4FGG1153C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3S5000-4FGG1153C


XC3S5000-4FGG1153C
F20-XC3S5000-4FGG1153C
Active
BGA

XC3S5000-4FGG1153C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3S5000-4FGG1153C Attributes


Type Description Select

XC3S5000-4FGG1153C Overview



The XC3S5000-4FGG1153C chip model is a powerful and advanced model from Xilinx, a leader in the field of programmable logic devices. It is a field-programmable gate array (FPGA) device that uses the Spartan-3E family of FPGA devices. This chip model is designed to meet the needs of a wide range of applications, including image processing, embedded systems, and communications.


The XC3S5000-4FGG1153C chip model offers a number of advantages that make it attractive to users. It has a wide range of features and capabilities, including a high speed and low power consumption. It also has a high level of flexibility and scalability, allowing it to be used in a variety of applications. In addition, the FPGA device can be programmed with a variety of languages, including Verilog, VHDL, and C. This makes the chip model highly adaptable and suitable for a wide range of applications.


The XC3S5000-4FGG1153C chip model is expected to have a growing demand in the coming years, as more and more industries are looking to use FPGA devices for their applications. The chip model is well-suited for use in embedded systems, image processing, and communications, and is expected to be increasingly used in these fields. In addition, the chip model is also expected to be used in the development of future intelligent robots, as it is capable of providing the necessary computing power and flexibility.


The original design intention of the XC3S5000-4FGG1153C chip model was to provide a powerful, yet flexible solution for a variety of applications. It is capable of delivering high performance, while still maintaining a low power consumption. The chip model is also highly scalable and can be programmed with a variety of languages. This makes it suitable for a wide range of applications, from embedded systems to image processing and communications.


The XC3S5000-4FGG1153C chip model is also capable of being upgraded in the future. It is capable of being reprogrammed and modified to meet the changing needs of applications. This makes it a great choice for those looking for a powerful, yet flexible solution.


The XC3S5000-4FGG1153C chip model can be applied to the development and popularization of future intelligent robots. It is capable of providing the necessary computing power and flexibility for these types of applications. In addition, the chip model is also capable of being programmed with a variety of languages, making it suitable for a wide range of applications. To use the chip model effectively, it is important to have a good understanding of the FPGA technology and the related programming languages. Additionally, having a good understanding of the application domain is also important.



5,679 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote