AMD Xilinx
XC3S5000-4FG1156I
XC3S5000-4FG1156I ECAD Model
XC3S5000-4FG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 784 | |
| Number of Outputs | 784 | |
| Number of Logic Cells | 74880 | |
| Number of Equivalent Gates | 5000000 | |
| Number of CLBs | 8320 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8320 CLBS, 5000000 GATES | |
| Clock Frequency-Max | 630 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S5000-4FG1156I Datasheet Download
XC3S5000-4FG1156I Overview
The Xilinx XC3S5000-4FG1156I chip model is a powerful and versatile solution for a wide range of applications. It is a field-programmable gate array (FPGA) that can be used to implement complex logic designs, such as digital signal processing (DSP) and embedded systems. This chip model is equipped with high-speed transceivers, high-speed memory interfaces, and high-performance logic blocks, making it ideal for a variety of applications.
The XC3S5000-4FG1156I chip model has been widely used in the industry, and its demand is expected to continue to grow in the future. It can be used in many industries, such as aerospace, automotive, communication, consumer electronics, industrial automation, medical, and military. It is also suitable for applications in networks and intelligent scenarios, such as the Internet of Things (IoT), 5G, autonomous driving, and artificial intelligence (AI).
In addition, the XC3S5000-4FG1156I chip model is designed to be flexible and customizable. It can be programmed to support a variety of technologies, such as high-speed transceivers, high-speed memory interfaces, and high-performance logic blocks. This makes it possible to use the chip model in the era of fully intelligent systems. It can be used to develop advanced applications, such as AI-based applications, that require high-speed data processing and analysis.
The XC3S5000-4FG1156I chip model has many advantages and is expected to remain in demand in the future. It is a powerful and versatile solution for a wide range of applications and can be used in many industries. It is also suitable for applications in networks and intelligent scenarios, and can be programmed to support a variety of technologies. This makes it possible to use the chip model in the era of fully intelligent systems and develop advanced applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||