XC3S400AN-5FGG400C

The XC3S400AN-5FGG400C is an FPGA (Field Programmable Gate Array) chip manufactured by Xilinx Inc. It is a low-cost and low-power device, with a wide range of applications.

The XC3S400AN-5FGG400C has a maximum operating temperature of 85°C, and a maximum power dissipation of 3.5W. It has a die size of 6.8 mm x 6.8 mm and a total number of 400 logic cells. The device has a total of 6,400 flip-flops and 6,400 look-up tables, and a total of 12,800 configurable logic blocks. It also has an on-chip memory of 1,024 kbits, and a maximum clock frequency of 250 MHz.

The XC3S400AN-5FGG400C is suitable for a wide range of applications, such as embedded systems, automotive, industrial control, medical, and consumer electronics. It is a highly versatile chip that can be used to implement a variety of designs, including digital signal processing, computer vision, and image processing. The device is also suitable for applications that require high-speed data processing, such as high-speed networking, video processing, and data security.

Overall, the XC3S400AN-5FGG400C is an excellent choice for a wide range of applications, due to its low-power and low-cost design, and its wide range of features.