XC3S400A-4FTG256AGQ
XC3S400A-4FTG256AGQ
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AMD Xilinx

XC3S400A-4FTG256AGQ


XC3S400A-4FTG256AGQ
F20-XC3S400A-4FTG256AGQ
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XC3S400A-4FTG256AGQ ECAD Model


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XC3S400A-4FTG256AGQ Attributes


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XC3S400A-4FTG256AGQ Overview



The XC3S400A-4FTG256AGQ is a versatile chip model that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the Hardware Description Language (HDL), allowing for the development of complex and powerful applications. The original design intention of this chip model was to provide a powerful and flexible solution for a wide range of applications. It is capable of being upgraded in the future to support more advanced features and capabilities, making it a great choice for communication systems.


The XC3S400A-4FTG256AGQ is an integrated circuit that features a Xilinx Spartan-3 FPGA, which has 256 logic cells and 400 I/O pins. It has a maximum operating frequency of 200 MHz, and it supports a variety of standard protocols, including USB, Ethernet, and Serial Peripheral Interface (SPI). It also features a wide range of peripherals, such as timers, counters, and digital-to-analog converters, making it a great choice for embedded systems.


When designing with the XC3S400A-4FTG256AGQ, it is important to consider the specific requirements of the application. This includes the performance requirements, power consumption, and any other design considerations. It is also important to consider the cost of the chip model, as well as the cost of any additional components that may be needed. Additionally, it is important to consider any potential design limitations, such as the maximum operating frequency or the number of I/O pins.


When using the XC3S400A-4FTG256AGQ, it is important to be aware of the potential risks associated with its use. This includes the potential for electrical noise or interference, as well as the potential for overheating. Additionally, it is important to consider the potential for data corruption or loss, as well as the potential for security issues. It is also important to consider the potential for hardware failures, as well as any potential legal issues associated with the use of the chip model.


To demonstrate the capabilities of the XC3S400A-4FTG256AGQ, there are a number of case studies available. These case studies provide detailed information on the design and implementation of a variety of applications, including digital signal processing, embedded systems, and image processing. Additionally, these case studies provide information on the performance of the chip model, as well as any potential issues that may arise.


In conclusion, the XC3S400A-4FTG256AGQ is a versatile chip model that can be used for a variety of applications. It is designed to be used with the HDL, allowing for the development of powerful and complex applications. Additionally, it is capable of being upgraded in the future to support more advanced features and capabilities. When using the XC3S400A-4FTG256AGQ, it is important to consider the specific requirements of the application, as well as any potential risks associated with its use. Additionally, there are a number of case studies available that demonstrate the capabilities of the chip model.



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