XC3S400A-4FG320C
XC3S400A-4FG320C
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rohs

AMD Xilinx

XC3S400A-4FG320C


XC3S400A-4FG320C
F20-XC3S400A-4FG320C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-320
FBGA-320

XC3S400A-4FG320C ECAD Model


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XC3S400A-4FG320C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 251
Number of Outputs 192
Number of Logic Cells 8064
Number of Equivalent Gates 400000
Number of CLBs 896
Combinatorial Delay of a CLB-Max 710 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 896 CLBS, 400000 GATES
Clock Frequency-Max 667 MHz
Power Supplies 1.2,2.5/3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B320
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 320
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-320
Pin Count 320
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC3S400A-4FG320C Datasheet Download


XC3S400A-4FG320C Overview



The XC3S400A-4FG320C chip model is an advanced field-programmable gate array (FPGA) that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming. With its advanced features, the XC3S400A-4FG320C is capable of being used in a variety of networks and intelligent scenarios.


In terms of product description, the XC3S400A-4FG320C is a low-cost, low-power FPGA with a wide range of features. It includes a Xilinx Spartan-3E FPGA with a maximum capacity of 4 million system gates and a wide range of I/O options. It also includes a high-speed serial transceiver, a high-speed differential clock network, and a high-performance DSP block. Furthermore, the XC3S400A-4FG320C is designed to be compatible with a variety of development environments, including Xilinx ISE, Xilinx Vivado, and other industry-standard development tools.


In terms of actual case studies, the XC3S400A-4FG320C has been used in a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. For example, it has been used to develop a high-performance, low-power, embedded processor for a medical imaging system. In this case, the XC3S400A-4FG320C was used to develop a system that was able to process images from a variety of medical imaging devices. Additionally, the XC3S400A-4FG320C was also used in a project to develop a low-power, high-speed, digital signal processing system for a radar system.


When using the XC3S400A-4FG320C, it is important to pay attention to the design requirements of the chip. For example, the chip must be programmed using HDL language, and the design must be optimized for the chip's specific features. Additionally, the design must be tested and verified to ensure that it meets the required performance parameters.


In the era of fully intelligent systems, the XC3S400A-4FG320C is well-suited for a variety of applications. For example, it can be used to develop embedded processors for intelligent systems, such as autonomous vehicles, as well as for high-performance digital signal processing and image processing applications. Additionally, the XC3S400A-4FG320C is capable of supporting a wide range of development environments, making it an ideal choice for intelligent system design.


In conclusion, the XC3S400A-4FG320C is a powerful, low-cost, low-power FPGA that is suitable for a variety of applications, including high-performance digital signal processing, embedded processing, and image processing. It is capable of being used in a variety of networks and intelligent scenarios, and is well-suited for the era of fully intelligent systems. When using the XC3S400A-4FG320C, it is important to pay attention to the design requirements of the chip, including programming using HDL language and optimizing the design for the chip's specific features.



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Pricing (USD)

QTY Unit Price Ext Price
1+ $25.2067 $25.2067
10+ $24.9357 $249.3568
100+ $23.5805 $2,358.0480
1000+ $22.2253 $11,112.6400
10000+ $20.3280 $20,328.0000
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