
AMD Xilinx
XC3S4000L-4FG900C
XC3S4000L-4FG900C ECAD Model
XC3S4000L-4FG900C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 633 | |
Number of Outputs | 633 | |
Number of Logic Cells | 62208 | |
Number of Equivalent Gates | 4000000 | |
Number of CLBs | 6912 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 6912 CLBS, 4000000 GATES | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-900 | |
Pin Count | 900 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3S4000L-4FG900C Datasheet Download
XC3S4000L-4FG900C Overview
The chip model XC3S4000L-4FG900C is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx, Inc. It is designed for applications that require high levels of performance, reliability, and scalability. This chip model is particularly suitable for applications that require high-speed data processing and communication, such as video processing, image processing, and machine learning.
The XC3S4000L-4FG900C has several advantages over other FPGA models. It features a low-power, high-performance architecture that is ideal for embedded applications. It also offers a wide range of I/O capabilities, including a high-speed serial port, a low-speed serial port, and a variety of other peripheral interfaces. Additionally, this model offers a comprehensive set of development tools, including the Xilinx Vivado Design Suite and the Xilinx Software Development Kit.
The XC3S4000L-4FG900C is expected to be in high demand in the future, as more applications are developed that require the high performance and reliability of this chip model. This is due to the fact that the XC3S4000L-4FG900C is an ideal solution for applications that require high-speed data processing and communication. Additionally, the low-power, high-performance architecture of this chip model makes it a cost-effective solution for embedded applications.
In terms of product description and design requirements, the XC3S4000L-4FG900C is based on the Spartan-6 FPGA architecture and features a 900K logic cells capacity. It is optimized for high-speed data processing, with a maximum clock frequency of 350MHz and a maximum I/O bandwidth of 1.25Gbps. It also offers a wide range of I/O capabilities, including a high-speed serial port, a low-speed serial port, and a variety of other peripheral interfaces.
In terms of actual case studies, the XC3S4000L-4FG900C has been used in a variety of applications, including video processing, image processing, and machine learning. In particular, the chip model has been used in the development of a high-speed video processor, which is capable of processing up to 1080p video at 60 frames per second. Additionally, the chip model has been used in the development of a machine learning system, which is capable of recognizing objects in real-time.
Finally, when considering the application environment of the XC3S4000L-4FG900C, it is important to consider the specific technologies that are required. For example, if the application requires high-speed data processing, then the chip model must be capable of supporting high clock frequencies. Additionally, if the application requires a wide range of I/O capabilities, then the chip model must be capable of supporting a variety of peripheral interfaces.
In conclusion, the chip model XC3S4000L-4FG900C is an ideal solution for applications that require high-speed data processing and communication. It offers a low-power, high-performance architecture, a wide range of I/O capabilities, and a comprehensive set of development tools. Additionally, it has been used in a variety of applications, including video processing, image processing, and machine learning. When considering the application environment of the XC3S4000L-4FG900C, it is important to consider the specific technologies that are required.
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1,084 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $227.4129 | $227.4129 |
10+ | $224.9676 | $2,249.6760 |
100+ | $212.7411 | $21,274.1100 |
1000+ | $200.5146 | $100,257.3000 |
10000+ | $183.3975 | $183,397.5000 |
The price is for reference only, please refer to the actual quotation! |