AMD Xilinx
XC3S4000-5FG900I
XC3S4000-5FG900I ECAD Model
XC3S4000-5FG900I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 633 | |
| Number of Outputs | 633 | |
| Number of Logic Cells | 62208 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S4000-5FG900I Datasheet Download
XC3S4000-5FG900I Overview
The XC3S4000-5FG900I chip model is the latest offering from Xilinx, a leader in programmable logic devices. This chip model is designed to provide the highest performance with the lowest power consumption and cost. It is a field-programmable gate array (FPGA) that can be used in a wide range of applications, from embedded systems to networking and communications.
The XC3S4000-5FG900I chip model provides a range of features that make it ideal for use in the most demanding applications. It has the highest performance, with a maximum clock frequency of 900 MHz and a total of 5,000 logic cells. It also has a low power consumption of only 5W, making it suitable for battery-powered applications. The chip model also has a wide range of I/O and memory interfaces, making it suitable for a variety of applications.
The XC3S4000-5FG900I chip model is expected to be widely used in a variety of industries in the future. It is suitable for use in embedded systems, such as automotive, medical, and industrial automation, as well as in communications, networking, and other applications. In addition, the chip model is expected to be used in the Internet of Things (IoT), allowing for the creation of intelligent systems and scenarios.
The XC3S4000-5FG900I chip model is also expected to be used in the era of fully intelligent systems. It is capable of supporting a range of new technologies, such as machine learning and artificial intelligence. This chip model is also expected to be used in networks, allowing for more efficient and secure data transmission. Furthermore, it is expected to be used in a range of intelligent scenarios, such as autonomous vehicles and intelligent home systems.
In conclusion, the XC3S4000-5FG900I chip model is the latest offering from Xilinx and is expected to be widely used in a variety of industries in the future. It is capable of supporting a range of new technologies, including machine learning and artificial intelligence, and is expected to be used in networks and intelligent scenarios. This chip model is expected to be a key component in the era of fully intelligent systems.
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3,531 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $191.8737 | $191.8737 |
| 10+ | $189.8105 | $1,898.1054 |
| 100+ | $179.4947 | $17,949.4746 |
| 1000+ | $169.1790 | $84,589.4780 |
| 10000+ | $154.7369 | $154,736.8500 |
| The price is for reference only, please refer to the actual quotation! | ||