AMD Xilinx
XC3S4000-4FGG1156C
XC3S4000-4FGG1156C ECAD Model
XC3S4000-4FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 712 | |
| Number of Outputs | 712 | |
| Number of Logic Cells | 62208 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 6912 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6912 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 630 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3S4000-4FGG1156C Datasheet Download
XC3S4000-4FGG1156C Overview
The XC3S4000-4FGG1156C chip model is a powerful and versatile device designed to meet the needs of modern digital signal processing, embedded processing, and image processing. This chip model is designed to be used with the HDL language, which is a language specifically designed for hardware description. With its powerful capabilities, the XC3S4000-4FGG1156C chip model is well suited for a variety of applications.
The XC3S4000-4FGG1156C chip model is a great choice for those looking for an efficient, reliable, and cost-effective solution for their digital signal processing, embedded processing, and image processing needs. With its versatile design and robust features, the XC3S4000-4FGG1156C chip model is well-suited for a wide range of applications. As the demand for high-performance digital signal processing, embedded processing, and image processing solutions continues to grow, the XC3S4000-4FGG1156C chip model is expected to remain a popular choice for many applications.
The XC3S4000-4FGG1156C chip model offers a number of advantages over competing solutions. It is designed to be highly efficient, allowing it to process data faster and more accurately than other solutions. Additionally, the XC3S4000-4FGG1156C chip model is designed to be cost-effective and reliable, making it a great choice for those looking for a long-term solution.
In order to remain competitive, the XC3S4000-4FGG1156C chip model must also be able to support new technologies. As the demand for digital signal processing, embedded processing, and image processing solutions continues to grow, the XC3S4000-4FGG1156C chip model must be able to keep up with the latest trends in technology. This means that the chip model must be able to support new technologies as they become available.
The XC3S4000-4FGG1156C chip model is a great choice for those looking for a reliable, efficient, and cost-effective solution for their digital signal processing, embedded processing, and image processing needs. With its versatile design, robust features, and ability to support new technologies, the XC3S4000-4FGG1156C chip model is expected to remain a popular choice for many applications in the future. As the demand for high-performance digital signal processing, embedded processing, and image processing solutions continues to grow, the XC3S4000-4FGG1156C chip model is expected to remain a popular choice for many applications.
You May Also Be Interested In
2,841 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $144.7173 | $144.7173 |
| 10+ | $143.1612 | $1,431.6120 |
| 100+ | $135.3807 | $13,538.0700 |
| 1000+ | $127.6002 | $63,800.1000 |
| 10000+ | $116.7075 | $116,707.5000 |
| The price is for reference only, please refer to the actual quotation! | ||