XC3S4000-4FG900
XC3S4000-4FG900
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
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AMD Xilinx

XC3S4000-4FG900


XC3S4000-4FG900
F20-XC3S4000-4FG900
Active
BGA

XC3S4000-4FG900 ECAD Model


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XC3S4000-4FG900 Attributes


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XC3S4000-4FG900 Overview



The chip model XC3S4000-4FG900 is a powerful programmable logic device for digital system design. It has the capability of integrating logic, memory, and analog functions into a single chip. This chip model has been widely used in many industries, such as industrial automation, automotive, aerospace, and medical. With its wide range of applications, XC3S4000-4FG900 is a popular choice among many professionals.


The chip model XC3S4000-4FG900 is designed with many features, such as high-speed operation, low power consumption, and high-density integration. It is capable of providing up to 4 million logic cells, with up to 9,000 logic elements. This makes it an ideal choice for applications that require high-speed operation, high-density integration, and low power consumption.


The chip model XC3S4000-4FG900 is also capable of supporting a wide range of new technologies. It is able to support a variety of communication protocols, such as Ethernet, USB, and CAN. It also supports a range of intelligent systems, such as machine learning, deep learning, and natural language processing. This makes it an ideal choice for applications that require the support of new technologies.


In addition, the chip model XC3S4000-4FG900 is also suitable for use in networks. It is capable of supporting a wide range of network topologies, such as star, ring, and mesh. It also supports a variety of protocols, such as Ethernet, Wi-Fi, and Bluetooth. This makes it an ideal choice for applications that require network support.


The chip model XC3S4000-4FG900 can also be used in the era of fully intelligent systems. It is capable of supporting a wide range of intelligent systems, such as machine learning, deep learning, and natural language processing. This makes it an ideal choice for applications that require support for intelligent systems.


The product description and specific design requirements of the chip model XC3S4000-4FG900 can be found in the product datasheet. The datasheet provides a detailed description of the chip’s features, such as its logic cells, logic elements, and communication protocols. It also provides information about the chip’s power consumption, operating temperature, and other design requirements.


In addition, there are also actual case studies and precautions that should be taken when using the chip model XC3S4000-4FG900. These case studies provide an insight into how the chip model has been used in various applications, and the precautions that should be taken to ensure that it is used correctly. This can help to ensure that the chip model is used in the most effective way possible.


In conclusion, the chip model XC3S4000-4FG900 is a powerful programmable logic device for digital system design. It is capable of providing high-speed operation, low power consumption, and high-density integration. It is also capable of supporting a wide range of new technologies and intelligent systems. The product description and specific design requirements of the chip model XC3S4000-4FG900 can be found in the product datasheet, and there are also actual case studies and precautions that should be taken when using the chip model. This makes it an ideal choice for applications that require the support of new technologies and intelligent systems.



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