AMD Xilinx
XC3S4000-4FG1156I
XC3S4000-4FG1156I ECAD Model
XC3S4000-4FG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 712 | |
| Number of Outputs | 712 | |
| Number of Logic Cells | 62208 | |
| Number of Equivalent Gates | 4000000 | |
| Number of CLBs | 6912 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6912 CLBS, 4000000 GATES | |
| Clock Frequency-Max | 630 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S4000-4FG1156I Datasheet Download
XC3S4000-4FG1156I Overview
The XC3S4000-4FG1156I chip model is a state-of-the-art integrated circuit designed to meet the needs of various industries. It is a powerful, highly integrated, and cost-effective solution that allows users to quickly and easily design and implement complex systems. With its advanced features, the XC3S4000-4FG1156I chip model is a popular choice for applications such as industrial control, automotive, telecommunications, and consumer electronics.
The XC3S4000-4FG1156I chip model is designed to provide a high level of performance and flexibility. It features a 4-layer FPGA architecture that enables users to quickly and easily develop complex systems. The chip model also includes a wide range of peripherals, including UART, SPI, I2C, and CAN interfaces. Additionally, the chip model supports various power management features, including power-down, sleep, and standby modes.
The XC3S4000-4FG1156I chip model offers a number of advantages over other chip models. It is designed to be cost-effective and highly reliable, making it an ideal choice for many applications. Additionally, the chip model is designed to be highly flexible, allowing users to quickly and easily customize their systems to meet their specific needs.
The XC3S4000-4FG1156I chip model is expected to remain in high demand in the coming years. Its advanced features and cost-effective design make it an ideal choice for a wide range of industries, including industrial control, automotive, telecommunications, and consumer electronics. Additionally, the chip model is designed to be highly upgradable, allowing users to easily upgrade their systems to meet their changing needs.
The XC3S4000-4FG1156I chip model is designed to meet the needs of various industries. It features a 4-layer FPGA architecture and a wide range of peripherals, including UART, SPI, I2C, and CAN interfaces. Additionally, the chip model supports various power management features, including power-down, sleep, and standby modes. The chip model is also designed to be highly upgradable, allowing users to easily upgrade their systems to meet their changing needs.
The XC3S4000-4FG1156I chip model is designed to meet specific design requirements. For example, the chip model is designed to operate at a temperature range of -40°C to +85°C and is rated to withstand a maximum voltage of 3.3V. Additionally, the chip model is designed to be highly reliable and is rated to provide an MTBF of over 200,000 hours.
The XC3S4000-4FG1156I chip model has been used in a number of successful applications. For example, the chip model has been used in automotive applications, such as engine control and transmission control systems. Additionally, the chip model has been used in industrial control systems, such as robotic arms and automated production lines.
When using the XC3S4000-4FG1156I chip model, it is important to consider certain precautions. For example, the chip model should not be exposed to temperatures beyond its rated range. Additionally, the chip model should not be exposed to voltages beyond its rated maximum voltage. Additionally, the chip model should not be used in applications that require high reliability, such as medical or aerospace applications.
In conclusion, the XC3S4000-4FG1156I chip model is a powerful, highly integrated, and cost-effective solution that allows users to quickly and easily design and implement complex systems. With its advanced features, the XC3S4000-4FG1156I chip model is expected to remain in high demand in the coming years. The chip model is designed to be highly upgradable, allowing users to easily upgrade their systems to meet their changing needs. However, it is important to consider certain precautions when using the chip model, such as avoiding temperatures and voltages beyond its rated range.
You May Also Be Interested In
1,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $211.5995 | $211.5995 |
| 10+ | $209.3242 | $2,093.2420 |
| 100+ | $197.9479 | $19,794.7881 |
| 1000+ | $186.5716 | $93,285.7830 |
| 10000+ | $170.6447 | $170,644.7250 |
| The price is for reference only, please refer to the actual quotation! | ||