XC3S400-4FGG676I
XC3S400-4FGG676I
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rohs

AMD Xilinx

XC3S400-4FGG676I


XC3S400-4FGG676I
F20-XC3S400-4FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, LEAD FREE, FBGA-676
LEAD FREE, FBGA-676

XC3S400-4FGG676I ECAD Model


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XC3S400-4FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Equivalent Gates 50000
Number of CLBs 192
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Organization 192 CLBS, 50000 GATES
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Package Description LEAD FREE, FBGA-676
Part Package Code BGA
Pin Count 676

XC3S400-4FGG676I Datasheet Download


XC3S400-4FGG676I Overview



The XC3S400-4FGG676I chip model is a state-of-the-art integrated circuit designed for a variety of applications. It is a field-programmable gate array (FPGA) chip that is reprogrammable, allowing for flexible usage and adaptation to various scenarios. As a result, it is becoming increasingly popular among a wide range of industries.


The XC3S400-4FGG676I chip model is designed for high-performance applications. It has a maximum clock frequency of 400 MHz, allowing for faster processing speeds than traditional FPGAs. Additionally, the chip is designed to be power efficient, with a power consumption of only 2.8W. This makes it an ideal choice for applications that require low power consumption.


The XC3S400-4FGG676I chip model is also designed with a high level of connectivity. It is capable of interfacing with multiple communication protocols, such as USB, Ethernet, and CAN. This allows for the easy integration of the chip into existing systems. Furthermore, the chip is equipped with a wide range of peripherals, such as GPIOs, ADCs, and PWM, allowing for greater flexibility and customization.


In terms of future trends, the XC3S400-4FGG676I chip model is expected to be in high demand due to its versatility and performance. As more industries become increasingly reliant on technology, the demand for FPGAs is expected to grow. Furthermore, the chip's power efficiency makes it a preferred choice for applications that require low power consumption.


When it comes to the application environment, the XC3S400-4FGG676I chip model is designed to be compatible with a wide range of technologies. It can support technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT). This allows for the development of applications that are tailored to the specific needs of the user.


In conclusion, the XC3S400-4FGG676I chip model is a powerful and versatile integrated circuit that is suitable for a wide range of applications. Its high performance, low power consumption, and wide range of connectivity options make it an ideal choice for many industries. Furthermore, its compatibility with various technologies makes it a preferred choice for applications that require the support of new technologies.



2,460 In Stock


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Unit Price: $73.067
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $67.9523 $67.9523
10+ $67.2216 $672.2164
100+ $63.5683 $6,356.8290
1000+ $59.9149 $29,957.4700
10000+ $54.8003 $54,800.2500
The price is for reference only, please refer to the actual quotation!

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