XC3S300E-6FG456I
XC3S300E-6FG456I
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AMD Xilinx

XC3S300E-6FG456I


XC3S300E-6FG456I
F20-XC3S300E-6FG456I
Active
BGA-456

XC3S300E-6FG456I ECAD Model


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XC3S300E-6FG456I Attributes


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XC3S300E-6FG456I Overview



The Xilinx XC3S300E-6FG456I is a powerful FPGA (Field Programmable Gate Array) chip that has been designed to meet the needs of a wide range of industries. This chip is a great choice for applications that need high performance, flexibility, and reliability. It is also a great choice for those who need to quickly adapt their system to changing requirements.


The XC3S300E-6FG456I has a number of features that make it stand out from other FPGA chips. It is capable of executing up to 300 million logic cells per second, making it one of the fastest FPGA chips on the market. Additionally, it has a wide range of I/O capabilities, including high-speed serial transceivers and memory controllers. This makes it ideal for applications that require high-speed data transfer. Furthermore, it has a low power consumption, which is ideal for applications that need to be energy-efficient.


The XC3S300E-6FG456I is also highly reliable, thanks to its advanced built-in self-test (BIST) technology. This technology allows the chip to detect and correct errors before they become a problem. This ensures that the chip will be able to handle any unexpected conditions that may arise.


The XC3S300E-6FG456I is also very versatile. It is capable of being used in a variety of applications, including embedded systems, communications systems, and industrial automation. Additionally, it is compatible with a wide range of development tools, making it easy to use.


When it comes to industry trends, the XC3S300E-6FG456I is expected to remain in demand in a variety of industries. Its high performance and reliability make it a great choice for applications that need to be able to quickly adapt to changing requirements. Additionally, its low power consumption makes it ideal for applications that need to be energy-efficient.


The XC3S300E-6FG456I also has a number of design requirements that need to be taken into account. For example, the chip requires a certain amount of power and must be connected to the correct voltage. Additionally, the chip must be programmed correctly in order for it to work properly.


Finally, when it comes to the application environment, the XC3S300E-6FG456I may require the support of new technologies in order to meet the needs of the application. For example, the chip may need to support a new communication protocol or a new type of memory. It is important to research the application requirements and determine whether the XC3S300E-6FG456I can meet them.


In conclusion, the XC3S300E-6FG456I is a powerful FPGA chip that is expected to remain in demand in a variety of industries. It has a number of features that make it stand out from other FPGA chips, including its high performance, flexibility, and reliability. Additionally, it has a number of design requirements that need to be taken into account. Finally, it may require the support of new technologies in order to meet the needs of the application.



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