XC3S250E-5PQG210C
XC3S250E-5PQG210C
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AMD Xilinx

XC3S250E-5PQG210C


XC3S250E-5PQG210C
F20-XC3S250E-5PQG210C
Active
QFP-210

XC3S250E-5PQG210C ECAD Model


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XC3S250E-5PQG210C Attributes


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XC3S250E-5PQG210C Overview



The XC3S250E-5PQG210C chip model is a state-of-the-art integrated circuit designed to meet the needs of a wide range of applications. Developed by Xilinx, the XC3S250E-5PQG210C integrates a powerful Spartan-3E FPGA with a rich set of embedded features, such as high-speed digital signal processing, high-speed memory, and embedded microcontroller cores. This chip model is specifically designed to provide a highly reliable, low-power solution for advanced communication systems.


The XC3S250E-5PQG210C chip model is designed to meet the needs of today’s demanding applications. It provides the highest performance, lowest power consumption, and most reliable operation for advanced communication systems. This chip model is based on the latest FPGA architecture, which allows for a high level of flexibility and scalability. The XC3S250E-5PQG210C is also capable of supporting new technologies, such as advanced security protocols and high-speed networking protocols.


The XC3S250E-5PQG210C chip model is designed with the latest industry trends in mind. It is capable of supporting the latest technologies and standards, such as IEEE 802.11ac, Bluetooth 5.0, and USB 3.0. This chip model also supports advanced communication systems, such as wireless mesh networks, cellular networks, and satellite communications. Additionally, the XC3S250E-5PQG210C is designed to be easily upgradable to support future technologies.


The product description of the XC3S250E-5PQG210C chip model includes a detailed description of the features and capabilities of the chip. It also includes a list of the supported technologies, as well as the power consumption, operating temperature range, and other specifications. Additionally, the product description includes a list of the recommended applications, as well as a list of the precautions and safety measures that should be taken when using the chip.


In conclusion, the XC3S250E-5PQG210C chip model is a powerful, reliable, and low-power solution for advanced communication systems. It is designed to meet the needs of today’s demanding applications and is capable of supporting the latest technologies and standards. Additionally, the XC3S250E-5PQG210C is designed to be easily upgradable to support future technologies, making it a great choice for future applications.



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