AMD Xilinx
XC3S250E-5CPG132C
XC3S250E-5CPG132C ECAD Model
XC3S250E-5CPG132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S250E-5CPG132C Datasheet Download
XC3S250E-5CPG132C Overview
The XC3S250E-5CPG132C chip model is a high-performance, cost-effective FPGA from Xilinx. It has a wide range of applications in various industries, including industrial, consumer, automotive, and aerospace. The model is designed to provide enhanced performance and scalability for a variety of applications.
The XC3S250E-5CPG132C chip model is equipped with a wide variety of features that make it suitable for a range of applications. It includes a high-speed, low-power, and flexible architecture that enables it to be used in a variety of applications. It also has a wide range of I/O options, including LVDS, USB, Ethernet, and more. In addition, it has a high-speed, low-power, and programmable logic that makes it suitable for a variety of applications.
The XC3S250E-5CPG132C chip model is expected to be in high demand in the future due to its wide range of applications. It is expected to be used in a variety of intelligent scenarios, including autonomous vehicles, robotics, and home automation. It is also expected to be used in the era of fully intelligent systems, as it is equipped with advanced features such as AI and machine learning capabilities.
The XC3S250E-5CPG132C chip model is designed to meet specific design requirements. It has a wide range of I/O options, including LVDS, USB, Ethernet, and more. It also has a wide range of programmable logic, including ALU, RAM, and ROM. In addition, it has a high-speed, low-power, and flexible architecture that enables it to be used in a variety of applications.
The XC3S250E-5CPG132C chip model has been used in a variety of case studies. For example, it has been used in the development of an autonomous vehicle system, a robotic arm, and a home automation system. In each of these cases, the chip model was able to meet the specific design requirements and provide the desired performance.
When using the XC3S250E-5CPG132C chip model, it is important to take certain precautions. For example, it is important to ensure that the design is optimized for the specific application and that the chip model is not overloaded. In addition, it is important to ensure that the chip model is properly cooled to prevent overheating. Finally, it is important to ensure that the chip model is properly protected from dust and moisture.
In conclusion, the XC3S250E-5CPG132C chip model is a high-performance, cost-effective FPGA from Xilinx. It has a wide range of applications in various industries, including industrial, consumer, automotive, and aerospace. It is expected to be in high demand in the future due to its wide range of applications and features, including AI and machine learning capabilities. It is designed to meet specific design requirements and has been used in a variety of case studies. When using the chip model, it is important to take certain precautions to ensure that it is properly protected and cooled.
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4,389 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5.9829 | $5.9829 |
| 10+ | $5.9185 | $59.1854 |
| 100+ | $5.5969 | $559.6884 |
| 1000+ | $5.2752 | $2,637.6120 |
| 10000+ | $4.8249 | $4,824.9000 |
| The price is for reference only, please refer to the actual quotation! | ||