AMD Xilinx
XC3S250E-5CP132C
XC3S250E-5CP132C ECAD Model
XC3S250E-5CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | CSP-132 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 132 | |
| ECCN Code | EAR99 |
XC3S250E-5CP132C Datasheet Download
XC3S250E-5CP132C Overview
The XC3S250E-5CP132C is a cutting-edge chip model developed by Xilinx, a leading provider of programmable logic solutions. This chip model features a Spartan-3E FPGA architecture, which is designed to deliver improved performance, lower power consumption, and greater flexibility. It is an excellent choice for applications ranging from consumer electronics to industrial automation.
The XC3S250E-5CP132C has several advantages over traditional chip models. It is capable of processing large amounts of data quickly and efficiently, making it ideal for applications such as image processing, network communications, and embedded systems. It also offers a wide range of features including on-chip memory, high-speed I/O, and advanced configurability. Additionally, the chip model is highly power-efficient, making it suitable for low-power applications.
As the demand for intelligent systems continues to grow, the XC3S250E-5CP132C is expected to be in high demand in the future. This chip model is well-suited to applications such as machine learning, artificial intelligence, and robotics, where its processing power and low power consumption make it an ideal choice. Additionally, its flexibility and configurability make it a great choice for applications such as network communications, where it can be used to create secure and reliable communication networks.
The original design intention of the XC3S250E-5CP132C was to provide users with a powerful and efficient chip model that could be used in a variety of applications. The chip model has been designed to be highly configurable, allowing users to customize it to their specific needs. Additionally, the chip model is highly scalable, making it suitable for applications that require a large amount of processing power.
The XC3S250E-5CP132C can also be upgraded to meet the demands of future applications. The chip model is capable of being upgraded to support more advanced features such as higher processing power, greater memory capacity, and enhanced security features. This makes it an ideal choice for applications such as advanced communication systems, where the chip model can be used to create secure and reliable communication networks.
The XC3S250E-5CP132C can also be applied to a variety of intelligent scenarios. It is capable of processing large amounts of data quickly and efficiently, making it suitable for applications such as machine learning, artificial intelligence, and robotics. Additionally, its flexibility and configurability make it a great choice for applications such as network communications, where it can be used to create secure and reliable communication networks.
The XC3S250E-5CP132C is also well-suited to the era of fully intelligent systems. Its powerful processing capabilities and low power consumption make it an ideal choice for applications such as machine learning, artificial intelligence, and robotics, where its processing power and low power consumption make it an ideal choice. Additionally, its flexibility and configurability make it a great choice for applications such as network communications, where it can be used to create secure and reliable communication networks.
In conclusion, the XC3S250E-5CP132C is an excellent choice for a variety of applications due to its powerful processing capabilities, low power consumption, and flexible design. It is expected to be in high demand in the future as the demand for intelligent systems continues to grow. Additionally, it can be upgraded to meet the demands of future applications and can be applied to a variety of intelligent scenarios. The XC3S250E-5CP132C is an ideal choice for applications such as machine learning, artificial intelligence, and robotics, and is also suitable for the era of fully intelligent systems.
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