AMD Xilinx
XC3S250E-4TQG144CS1
XC3S250E-4TQG144CS1 ECAD Model
XC3S250E-4TQG144CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 108 | |
| Number of Outputs | 80 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | LFQFP, QFP144,.87SQ,20 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | QFP | |
| Pin Count | 144 |
XC3S250E-4TQG144CS1 Datasheet Download
XC3S250E-4TQG144CS1 Overview
The XC3S250E-4TQG144CS1 chip model is a highly advanced integrated circuit designed to meet the needs of complex and demanding applications. It is a member of the Spartan-3E family of FPGA devices from Xilinx and is capable of providing the highest level of performance and reliability.
The original design intention of the XC3S250E-4TQG144CS1 was to provide a cost-effective solution for applications that require a high level of integration and performance. The chip model is built on a 0.18-micron process, and its features include an integrated block RAM, high-speed serial transceivers, and a wide range of I/O options. The chip model is also designed with advanced power management features, making it suitable for use in a variety of power-sensitive applications.
The XC3S250E-4TQG144CS1 chip model has the potential to be upgraded in the future, allowing it to keep up with the ever-changing needs of the market. With its high level of integration, the chip model can be used in a variety of applications, including advanced communication systems. It is also possible to use the chip model in networks, allowing it to be used in a variety of intelligent scenarios. In addition, the chip model can be used in the era of fully intelligent systems, allowing it to be used in applications that require the highest level of performance and reliability.
When it comes to the product description and specific design requirements of the XC3S250E-4TQG144CS1 chip model, it is important to consider the features of the device and the application it is intended for. It is also important to consider the actual case studies and precautions that need to be taken when using the chip model. This includes ensuring that the chip model is properly configured and programmed, as well as ensuring that the device is not exposed to extreme temperatures or other environmental conditions.
In conclusion, the XC3S250E-4TQG144CS1 chip model is a highly advanced integrated circuit designed to meet the needs of complex and demanding applications. It has the potential to be upgraded in the future, allowing it to keep up with the ever-changing needs of the market. It is also possible to use the chip model in networks, allowing it to be used in a variety of intelligent scenarios. It is important to consider the features of the device and the application it is intended for, as well as the actual case studies and precautions that need to be taken when using the chip model.
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3,614 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $33.2270 | $33.2270 |
| 10+ | $32.8698 | $328.6976 |
| 100+ | $31.0834 | $3,108.3360 |
| 1000+ | $29.2970 | $14,648.4800 |
| 10000+ | $26.7960 | $26,796.0000 |
| The price is for reference only, please refer to the actual quotation! | ||