AMD Xilinx
XC3S250E-4PQ208CS1
XC3S250E-4PQ208CS1 ECAD Model
XC3S250E-4PQ208CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 126 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | QFP-208 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S250E-4PQ208CS1 Datasheet Download
XC3S250E-4PQ208CS1 Overview
The XC3S250E-4PQ208CS1 chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of the HDL language for programming and development. This chip model is an ideal choice for those who need to create complex and powerful applications.
The XC3S250E-4PQ208CS1 is a versatile chip that can be used in a variety of industries and applications. Its high performance and flexibility make it a great choice for those who need to create complex and powerful programs. It is also suitable for applications that require the use of new technologies, such as artificial intelligence and machine learning.
The XC3S250E-4PQ208CS1 is also a great choice for those who are looking to develop and popularize future intelligent robots. It has the power and flexibility to handle complex tasks and can be used in a variety of industries. It requires technical expertise to use the chip effectively, but the rewards can be great for those who are willing to put in the time and effort.
In conclusion, the XC3S250E-4PQ208CS1 chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is suitable for a variety of industries and applications, and can be used to develop and popularize future intelligent robots. It requires technical expertise to use the chip effectively, but the rewards can be great for those who are willing to put in the time and effort.
You May Also Be Interested In
1,311 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||