AMD Xilinx
XC3S250E-4PQ208C
XC3S250E-4PQ208C ECAD Model
XC3S250E-4PQ208C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 126 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S250E-4PQ208C Datasheet Download
XC3S250E-4PQ208C Overview
The XC3S250E-4PQ208C chip model is a versatile, powerful and cost-effective FPGA solution from Xilinx. It is designed to meet the needs of a wide range of applications, from high-end communication systems to consumer electronics. This chip model has a wide range of features, including high-speed transceivers, high-performance and low-power logic, and advanced memory resources.
The XC3S250E-4PQ208C chip model is designed to provide the highest performance and maximum flexibility for a wide range of applications. Its high-speed transceivers provide up to 12.5 Gbps data rates, making it suitable for high-speed communication systems. The low-power logic and advanced memory resources make it ideal for consumer electronics applications. The FPGA also provides a wide range of I/O options and configurable logic blocks, making it an ideal solution for a variety of applications.
When it comes to industry trends, the XC3S250E-4PQ208C chip model is designed to keep up with the latest trends in the industry. It is capable of supporting the latest technologies, such as high-speed transceivers, low-power logic, and advanced memory resources. The chip model is also designed to be upgradable, allowing users to take advantage of new technologies as they become available.
Regarding the product description and specific design requirements of the XC3S250E-4PQ208C chip model, it is designed to provide a wide range of features and capabilities. It has a wide range of I/O options and configurable logic blocks, which allows users to customize their designs to meet their specific requirements. The chip model also supports a wide range of clock speeds, from 1 MHz to 250 MHz, making it suitable for a variety of applications.
In addition, the XC3S250E-4PQ208C chip model is designed to be cost-effective and reliable. It is designed to be compatible with a wide range of devices, including FPGAs, CPLDs, and microcontrollers. The chip model is also designed to be energy-efficient, making it suitable for applications where energy efficiency is a priority.
Finally, the XC3S250E-4PQ208C chip model is designed to be reliable and easy to use. It has a wide range of features, such as high-speed transceivers, low-power logic, and advanced memory resources, which make it suitable for a variety of applications. Additionally, the chip model is designed to be upgradable, allowing users to take advantage of new technologies as they become available.
In conclusion, the XC3S250E-4PQ208C chip model is a powerful, versatile and cost-effective FPGA solution from Xilinx. It is designed to provide the highest performance and maximum flexibility for a wide range of applications, from high-end communication systems to consumer electronics. It is designed to keep up with the latest trends in the industry, and is capable of supporting the latest technologies. The chip model is also designed to be upgradable and cost-effective, making it suitable for a variety of applications.
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5,472 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $24.8422 | $24.8422 |
| 10+ | $24.5750 | $245.7504 |
| 100+ | $23.2394 | $2,323.9440 |
| 1000+ | $21.9038 | $10,951.9200 |
| 10000+ | $20.0340 | $20,034.0000 |
| The price is for reference only, please refer to the actual quotation! | ||