AMD Xilinx
XC3S250E-4CPG132CS1
XC3S250E-4CPG132CS1 ECAD Model
XC3S250E-4CPG132CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | TFBGA, BGA132,14X14,20 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3S250E-4CPG132CS1 Datasheet Download
XC3S250E-4CPG132CS1 Overview
The XC3S250E-4CPG132CS1 chip model is a powerful and versatile integrated circuit (IC) designed for a wide range of applications. It is a Field Programmable Gate Array (FPGA) that is designed to provide a flexible and cost-effective solution to a variety of problems. This chip model is based on the Xilinx Spartan-3E family of FPGAs, which are designed for high-performance, low-power, and low-cost applications.
The XC3S250E-4CPG132CS1 chip model offers several advantages over other FPGAs. It is capable of high-speed operation and has a low power consumption. The chip model also features a wide range of I/O and memory options, as well as a rich set of features and peripherals. This makes it ideal for a variety of applications, such as communications, multimedia, and embedded systems.
The XC3S250E-4CPG132CS1 chip model is expected to be in high demand in the coming years, as more and more applications require the use of FPGAs. The chip model is also suitable for use in advanced communication systems, as it is capable of handling high-speed data transfers and is highly reliable. In addition, the chip model is designed to be easily upgradeable, allowing users to take advantage of new features as they become available.
The XC3S250E-4CPG132CS1 chip model is designed to meet the specific requirements of its users. The chip model has a wide range of I/O and memory options, as well as a rich set of features and peripherals. It is also designed to be easily upgradeable, allowing users to take advantage of new features as they become available.
In order to ensure the proper operation of the XC3S250E-4CPG132CS1 chip model, it is important to follow the instructions and guidelines provided in the product documentation. It is also important to take into account the specific requirements of the application in which the chip model is being used. For example, if the chip model is being used in a communications system, it is important to ensure that the chip model is compatible with the communication protocols used in the system.
The XC3S250E-4CPG132CS1 chip model has been successfully used in a variety of applications, including communications, multimedia, and embedded systems. In addition, it has been used in a number of case studies, which provide valuable insight into the performance and reliability of the chip model. These case studies can be used as a reference when considering the use of the chip model in new applications.
Overall, the XC3S250E-4CPG132CS1 chip model is a powerful and versatile integrated circuit (IC) designed for a wide range of applications. It offers a number of advantages over other FPGAs, including high-speed operation, low power consumption, and a wide range of I/O and memory options. It is also designed to be easily upgradeable, allowing users to take advantage of new features as they become available. Finally, it is important to follow the instructions and guidelines provided in the product documentation in order to ensure the proper operation of the chip model.
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1,767 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5.9829 | $5.9829 |
| 10+ | $5.9185 | $59.1854 |
| 100+ | $5.5969 | $559.6884 |
| 1000+ | $5.2752 | $2,637.6120 |
| 10000+ | $4.8249 | $4,824.9000 |
| The price is for reference only, please refer to the actual quotation! | ||