AMD Xilinx
XC3S250E-4CP132C
XC3S250E-4CP132C ECAD Model
XC3S250E-4CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 92 | |
| Number of Outputs | 85 | |
| Number of Logic Cells | 5508 | |
| Number of Equivalent Gates | 250000 | |
| Number of CLBs | 612 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 612 CLBS, 250000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S250E-4CP132C Datasheet Download
XC3S250E-4CP132C Overview
The chip model XC3S250E-4CP132C is a new generation of FPGA-based chip that has been developed to meet the needs of a wide range of industries. It is designed to provide a high-performance, low-power solution for applications that require complex logic and high-speed data processing. The model is equipped with a number of features that make it suitable for a variety of applications, including high-speed data transfer, video processing, and digital signal processing.
The XC3S250E-4CP132C chip model is a powerful tool for building intelligent robots and other automated systems. It is capable of handling complex tasks that require a high degree of accuracy, such as object recognition, navigation, and control. The model is also capable of performing multiple tasks in parallel, making it an ideal choice for applications that require simultaneous processing of multiple tasks.
The XC3S250E-4CP132C chip model has been designed to be highly versatile and can be used in a variety of industries. It is suitable for use in medical, industrial, and consumer applications, as well as in robotics and artificial intelligence applications. The model is also capable of providing a cost-effective solution for applications that require high-performance and low-power solutions.
The XC3S250E-4CP132C chip model is expected to become increasingly popular in the future as more industries look to adopt the technology. The model is expected to be used in a variety of applications, including medical, industrial, and consumer applications, as well as in robotics and artificial intelligence applications.
In order to use the XC3S250E-4CP132C chip model effectively, engineers and developers will need to be familiar with the technology. Knowledge of FPGA technology, digital signal processing, and computer architecture is essential for developing applications that make use of the model. Additionally, engineers and developers will need to be familiar with the tools and techniques used to program the chip model.
In conclusion, the XC3S250E-4CP132C chip model is a powerful tool for building intelligent robots and other automated systems. It is expected to become increasingly popular in the future as more industries look to adopt the technology. In order to use the model effectively, engineers and developers will need to be familiar with the technology and have the necessary skills to program the chip model.
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2,071 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20.7278 | $20.7278 |
| 10+ | $20.5050 | $205.0496 |
| 100+ | $19.3906 | $1,939.0560 |
| 1000+ | $18.2762 | $9,138.0800 |
| 10000+ | $16.7160 | $16,716.0000 |
| The price is for reference only, please refer to the actual quotation! | ||