
AMD Xilinx
XC3S200AN-5FTG256I
XC3S200AN-5FTG256I ECAD Model
XC3S200AN-5FTG256I Attributes
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XC3S200AN-5FTG256I Overview
The XC3S200AN-5FTG256I chip model is a new generation of FPGA chip developed by Xilinx. It is a low-cost and low-power FPGA, with a capacity of up to 200K logic cells and 256MB of on-chip memory. It has a wide range of applications, including communications, industrial control, medical, automotive, and consumer electronics.
The XC3S200AN-5FTG256I chip model is designed to meet the demands of advanced communication systems. It has a wide range of features, including high-speed transceivers, high-speed memory, and high-speed logic. It also has a wide range of I/O options, including LVDS, Ethernet, USB, and PCIe. It also has support for advanced communication protocols such as SONET, Gigabit Ethernet, and Fibre Channel.
The XC3S200AN-5FTG256I chip model is designed to be future-proof, with the ability to upgrade to new technologies as they become available. It has the ability to scale up to 500K logic cells and up to 1GB of on-chip memory. It also has support for advanced communication protocols such as 10G Ethernet, InfiniBand, and Fibre Channel over Ethernet.
The XC3S200AN-5FTG256I chip model is designed to be robust and reliable, with a wide range of features that make it suitable for use in a variety of applications. It has built-in security features, such as encryption and authentication, to ensure data integrity and protect against malicious attacks. It also has a wide range of I/O options, including LVDS, Ethernet, USB, and PCIe.
In addition, the XC3S200AN-5FTG256I chip model is designed to be power efficient, with power consumption of only 0.7W and a maximum operating temperature of 85°C. It also has a wide range of features that make it suitable for use in a variety of applications, including communications, industrial control, medical, automotive, and consumer electronics.
The XC3S200AN-5FTG256I chip model is a versatile and powerful FPGA, with a wide range of features that make it suitable for a variety of applications. It is designed to be future-proof and reliable, with the ability to upgrade to new technologies as they become available. It is also designed to be power efficient and secure, with a wide range of I/O options and built-in security features. With its robust design and wide range of features, the XC3S200AN-5FTG256I chip model is an ideal choice for advanced communication systems.
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