AMD Xilinx
XC3S200A-5FT256C
XC3S200A-5FT256C ECAD Model
XC3S200A-5FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 195 | |
| Number of Outputs | 160 | |
| Number of Logic Cells | 4032 | |
| Number of Equivalent Gates | 200000 | |
| Number of CLBs | 448 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 448 CLBS, 200000 GATES | |
| Clock Frequency-Max | 770 MHz | |
| Power Supplies | 1.2,2.5/3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC3S200A-5FT256C Datasheet Download
XC3S200A-5FT256C Overview
The XC3S200A-5FT256C chip model is a high-performance, field-programmable gate array (FPGA) designed for digital signal processing, embedded processing, and image processing applications. It is suitable for high-performance applications that require the use of HDL (hardware description language) and can be used to develop complex designs with relative ease.
The industry trends for the XC3S200A-5FT256C chip model and related industries are constantly evolving. As new technologies are developed, the application environment will require the support of these technologies in order to remain competitive. In order to keep up with the latest trends and technologies, designers must keep abreast of the latest developments and trends in the industry.
The product description and specific design requirements of the XC3S200A-5FT256C chip model are available in the product documentation. Designers must ensure that they understand the product requirements and design specifications in order to ensure a successful design. It is also important to consider actual case studies and precautions in order to avoid any potential issues.
The XC3S200A-5FT256C chip model is an excellent choice for digital signal processing, embedded processing, and image processing applications. With its support for HDL, designers can create complex designs with relative ease. It is important to keep up with the latest industry trends and technologies in order to remain competitive, and designers must understand the product requirements and design specifications in order to ensure a successful design. With the right design, the XC3S200A-5FT256C chip model can provide a powerful and reliable solution for a variety of applications.
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1,656 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $23.3586 | $23.3586 |
| 10+ | $23.1075 | $231.0746 |
| 100+ | $21.8516 | $2,185.1616 |
| 1000+ | $20.5958 | $10,297.8880 |
| 10000+ | $18.8376 | $18,837.6000 |
| The price is for reference only, please refer to the actual quotation! | ||