
AMD Xilinx
XC3S200A-4VQ100C
XC3S200A-4VQ100C ECAD Model
XC3S200A-4VQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 68 | |
Number of Outputs | 62 | |
Number of Logic Cells | 4032 | |
Number of Equivalent Gates | 200000 | |
Number of CLBs | 448 | |
Combinatorial Delay of a CLB-Max | 710 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 448 CLBS, 200000 GATES | |
Clock Frequency-Max | 667 MHz | |
Power Supplies | 1.2,1.2/3.3,3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e4 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.63SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | VQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC3S200A-4VQ100C Datasheet Download
XC3S200A-4VQ100C Overview
The chip model XC3S200A-4VQ100C is a device from Xilinx, a leading provider of programmable logic components. It is a Field Programmable Gate Array (FPGA) device that is used for a variety of applications, including digital signal processing, embedded systems, and network applications. This FPGA device is designed to be versatile, allowing users to customize their applications.
The XC3S200A-4VQ100C chip model has several advantages that make it an attractive choice for many applications. It is designed to be low-power, with a power consumption of only 0.7 W. Additionally, it is designed to be reliable and robust, with a maximum operating temperature of 100°C. Furthermore, it is designed with a high-speed clocking frequency of up to 200 MHz, making it suitable for high-performance applications.
The expected demand for the XC3S200A-4VQ100C chip model is likely to increase in the coming years. This is due to the increasing demand for high-performance, low-power, and reliable devices in the embedded systems, digital signal processing, and networking markets. Furthermore, with the development of 5G and the Internet of Things (IoT), the demand for FPGA devices is likely to increase as these technologies require more powerful and reliable components.
The original design intention of the XC3S200A-4VQ100C chip model was to provide a versatile and reliable FPGA device that could be used for a variety of applications. It is designed to be highly customizable, allowing users to tailor their applications to their specific needs. Additionally, the device is designed to be low-power, reliable, and high-speed, making it suitable for a range of applications.
The XC3S200A-4VQ100C chip model can be upgraded in the future to meet the needs of more advanced applications. This could include the addition of a larger number of logic elements, increased memory, and higher clock speeds. Additionally, the device can be used in more advanced communication systems, such as 5G and the Internet of Things (IoT).
The XC3S200A-4VQ100C chip model can be used in various network applications, including routers, switches, and gateways. Additionally, it can be used for various intelligent scenarios, such as facial recognition, robotics, and autonomous vehicles. Furthermore, it is possible that the device could be used in the era of fully intelligent systems, such as smart homes and smart cities.
In conclusion, the XC3S200A-4VQ100C chip model is an attractive choice for many applications due to its low-power, reliable, and high-speed design. The expected demand for this device is likely to increase in the coming years due to the increasing demand for high-performance, low-power, and reliable components. It can be upgraded in the future to meet the needs of more advanced applications, and can be used in various network applications and intelligent scenarios. Finally, it is possible that the device could be used in the era of fully intelligent systems.
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1,366 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $15.1553 | $15.1553 |
10+ | $14.9923 | $149.9232 |
100+ | $14.1775 | $1,417.7520 |
1000+ | $13.3627 | $6,681.3600 |
10000+ | $12.2220 | $12,222.0000 |
The price is for reference only, please refer to the actual quotation! |