XC3S200A-4VQ100C
XC3S200A-4VQ100C
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rohs

AMD Xilinx

XC3S200A-4VQ100C


XC3S200A-4VQ100C
F20-XC3S200A-4VQ100C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, VQFP-100
VQFP-100

XC3S200A-4VQ100C ECAD Model


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XC3S200A-4VQ100C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 68
Number of Outputs 62
Number of Logic Cells 4032
Number of Equivalent Gates 200000
Number of CLBs 448
Combinatorial Delay of a CLB-Max 710 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 448 CLBS, 200000 GATES
Clock Frequency-Max 667 MHz
Power Supplies 1.2,1.2/3.3,3.3 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
JESD-609 Code e4
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 100
Package Body Material PLASTIC/EPOXY
Package Code TFQFP
Package Equivalence Code TQFP100,.63SQ
Package Shape SQUARE
Package Style FLATPACK, THIN PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING
Terminal Pitch 500 µm
Terminal Position QUAD
Width 14 mm
Length 14 mm
Seated Height-Max 1.2 mm
Ihs Manufacturer XILINX INC
Part Package Code QFP
Package Description VQFP-100
Pin Count 100
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC3S200A-4VQ100C Datasheet Download


XC3S200A-4VQ100C Overview



The chip model XC3S200A-4VQ100C is a device from Xilinx, a leading provider of programmable logic components. It is a Field Programmable Gate Array (FPGA) device that is used for a variety of applications, including digital signal processing, embedded systems, and network applications. This FPGA device is designed to be versatile, allowing users to customize their applications.


The XC3S200A-4VQ100C chip model has several advantages that make it an attractive choice for many applications. It is designed to be low-power, with a power consumption of only 0.7 W. Additionally, it is designed to be reliable and robust, with a maximum operating temperature of 100°C. Furthermore, it is designed with a high-speed clocking frequency of up to 200 MHz, making it suitable for high-performance applications.


The expected demand for the XC3S200A-4VQ100C chip model is likely to increase in the coming years. This is due to the increasing demand for high-performance, low-power, and reliable devices in the embedded systems, digital signal processing, and networking markets. Furthermore, with the development of 5G and the Internet of Things (IoT), the demand for FPGA devices is likely to increase as these technologies require more powerful and reliable components.


The original design intention of the XC3S200A-4VQ100C chip model was to provide a versatile and reliable FPGA device that could be used for a variety of applications. It is designed to be highly customizable, allowing users to tailor their applications to their specific needs. Additionally, the device is designed to be low-power, reliable, and high-speed, making it suitable for a range of applications.


The XC3S200A-4VQ100C chip model can be upgraded in the future to meet the needs of more advanced applications. This could include the addition of a larger number of logic elements, increased memory, and higher clock speeds. Additionally, the device can be used in more advanced communication systems, such as 5G and the Internet of Things (IoT).


The XC3S200A-4VQ100C chip model can be used in various network applications, including routers, switches, and gateways. Additionally, it can be used for various intelligent scenarios, such as facial recognition, robotics, and autonomous vehicles. Furthermore, it is possible that the device could be used in the era of fully intelligent systems, such as smart homes and smart cities.


In conclusion, the XC3S200A-4VQ100C chip model is an attractive choice for many applications due to its low-power, reliable, and high-speed design. The expected demand for this device is likely to increase in the coming years due to the increasing demand for high-performance, low-power, and reliable components. It can be upgraded in the future to meet the needs of more advanced applications, and can be used in various network applications and intelligent scenarios. Finally, it is possible that the device could be used in the era of fully intelligent systems.



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Unit Price: $16.296
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Pricing (USD)

QTY Unit Price Ext Price
1+ $15.1553 $15.1553
10+ $14.9923 $149.9232
100+ $14.1775 $1,417.7520
1000+ $13.3627 $6,681.3600
10000+ $12.2220 $12,222.0000
The price is for reference only, please refer to the actual quotation!

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