XC3S2000-6FG900I
XC3S2000-6FG900I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3S2000-6FG900I


XC3S2000-6FG900I
F20-XC3S2000-6FG900I
Active
BGA

XC3S2000-6FG900I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3S2000-6FG900I Attributes


Type Description Select

XC3S2000-6FG900I Overview



The chip model XC3S2000-6FG900I is a high-performance, low-power FPGA (Field Programmable Gate Array) designed by Xilinx. It is a powerful, yet cost-effective solution for many applications. It has a wide range of features, including a high-speed serializer/deserializer (SERDES), high-speed transceivers, and high-speed I/Os. This chip model is suitable for a variety of applications, such as high-speed networking, imaging, and video processing.


The XC3S2000-6FG900I has several advantages over other chips. First, it has a low power consumption, which is important for applications that require long battery life or low power consumption. Second, it is highly scalable, allowing for future upgrades and modifications. Third, it has a high-speed serializer/deserializer (SERDES) and high-speed transceivers, enabling fast data transmission and reception. Finally, it has a high-speed I/O, allowing for high-speed data transfer.


The XC3S2000-6FG900I is a highly reliable chip model and is expected to be in high demand in the near future. It is suitable for a variety of applications, such as high-speed networking, imaging, and video processing. In addition, it is highly scalable, allowing for future upgrades and modifications. This makes it an ideal choice for advanced communication systems.


The XC3S2000-6FG900I has a number of design requirements. First, it requires a high-speed SERDES, high-speed transceivers, and high-speed I/O. Second, it must be able to handle a wide range of data rates, from 10 Mbps to 6 Gbps. Third, it must be able to support a variety of protocols, such as Ethernet, USB, and PCIe. Finally, it must be able to support a variety of data formats, such as 8b/10b and 64b/66b.


In order to ensure that the XC3S2000-6FG900I is used correctly, it is important to follow certain precautions. First, it is important to ensure that the chip is compatible with the application. Second, it is important to ensure that the chip is powered correctly and is not exposed to excessive heat or vibration. Third, it is important to ensure that the chip is properly connected to the system and that the data rates and protocols are correctly set. Finally, it is important to ensure that the chip is programmed correctly and that the data format is correct.


In conclusion, the XC3S2000-6FG900I is a powerful and cost-effective chip model that is suitable for a variety of applications. It has several advantages, including low power consumption, scalability, high-speed SERDES and transceivers, and high-speed I/O. It is expected to be in high demand in the near future, and it is suitable for advanced communication systems. It is important to follow certain precautions when using the chip, such as ensuring compatibility, power, connection, programming, and data format.



4,696 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote