XC3S2000-4FT256C
XC3S2000-4FT256C
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rohs

AMD Xilinx

XC3S2000-4FT256C


XC3S2000-4FT256C
F20-XC3S2000-4FT256C
Active
FIELD PROGRAMMABLE GATE ARRAY, FTBGA-256
FTBGA-256

XC3S2000-4FT256C ECAD Model


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XC3S2000-4FT256C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Equivalent Gates 50000
Number of CLBs 192
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 192 CLBS, 50000 GATES
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 1.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FTBGA-256
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3S2000-4FT256C Datasheet Download


XC3S2000-4FT256C Overview



The XC3S2000-4FT256C chip model is a highly advanced integrated circuit that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the Hardware Description Language (HDL) to provide powerful, efficient, and reliable performance. This chip model is a great choice for applications that require a high degree of accuracy and reliability.


The XC3S2000-4FT256C has many advantages over other chip models. It is designed to be highly efficient, with a low power consumption. This chip model also offers great flexibility, allowing users to customize the design to meet their specific needs. Additionally, the XC3S2000-4FT256C is designed to be compatible with a wide range of hardware and software platforms.


The XC3S2000-4FT256C is a great choice for applications that require a high degree of accuracy and reliability. As the demand for this type of chip grows, the XC3S2000-4FT256C is expected to become increasingly popular in the future. This chip model is also designed to be easily upgradable, allowing users to take advantage of new technologies and features. This makes the XC3S2000-4FT256C a great choice for applications that require advanced communication systems.


The XC3S2000-4FT256C was designed with the intention of providing users with an efficient, reliable, and powerful chip model. This chip model is designed to be easily upgradable, allowing users to take advantage of new technologies and features. This makes the XC3S2000-4FT256C a great choice for applications that require advanced communication systems. The XC3S2000-4FT256C is also designed to be compatible with a wide range of hardware and software platforms, making it a great choice for applications that require a high degree of accuracy and reliability.


In conclusion, the XC3S2000-4FT256C chip model is a great choice for applications that require a high degree of accuracy and reliability. It is designed to be highly efficient, with a low power consumption. Additionally, the XC3S2000-4FT256C is designed to be easily upgradable, allowing users to take advantage of new technologies and features. This makes the XC3S2000-4FT256C a great choice for applications that require advanced communication systems. As the demand for this type of chip grows, the XC3S2000-4FT256C is expected to become increasingly popular in the future.



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Unit Price: $127.1556
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $118.2547 $118.2547
10+ $116.9832 $1,169.8315
100+ $110.6254 $11,062.5372
1000+ $104.2676 $52,133.7960
10000+ $95.3667 $95,366.7000
The price is for reference only, please refer to the actual quotation!

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