AMD Xilinx
XC3S2000-4FG676I
XC3S2000-4FG676I ECAD Model
XC3S2000-4FG676I Attributes
| Type | Description | Select |
|---|---|---|
| Mfr | AMD Xilinx | |
| Series | Spartan®-3 | |
| Package | Bulk | |
| Number of LABs/CLBs | 5120 | |
| Number of Logic Elements/Cells | 46080 | |
| Total RAM Bits | 737280 | |
| Number of I/O | 489 | |
| Number of Gates | 2000000 | |
| Voltage - Supply | 1.14V ~ 1.26V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Base Product Number | XC3S2000 |
XC3S2000-4FG676I Datasheet Download
XC3S2000-4FG676I Overview
The XC3S2000-4FG676I is a high-performance field-programmable gate array (FPGA) device from Xilinx. This device has a total of 2000 logic cells, 4.5Mbits of block RAM, and 4 clock management tiles. It is based on the Spartan-3E architecture and is manufactured using a 0.13-micron process.
The XC3S2000-4FG676I offers 676 I/O pins that can be configured as either single-ended or differential pairs. It supports LVDS, LVPECL, and PCI Express standards. It also has an on-chip 1.8V regulator and a 3.3V I/O supply. The device has an operating temperature range of -40°C to +85°C and is available in a 676-pin FBGA package.
The XC3S2000-4FG676I is suitable for a wide range of applications including industrial automation, automotive, medical, and consumer electronics. It can be used for a variety of tasks such as image processing, data acquisition, embedded systems, and communications. It is also suitable for applications that require high speed data processing, low power consumption, and high reliability.
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5,282 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $252.8304 | $252.8304 |
| 10+ | $250.1118 | $2,501.1175 |
| 100+ | $236.5187 | $23,651.8722 |
| 1000+ | $222.9257 | $111,462.8460 |
| 10000+ | $203.8955 | $203,895.4500 |
| The price is for reference only, please refer to the actual quotation! | ||