XC3S200-5PQG210C
XC3S200-5PQG210C
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AMD Xilinx

XC3S200-5PQG210C


XC3S200-5PQG210C
F20-XC3S200-5PQG210C
Active
QFP-210

XC3S200-5PQG210C ECAD Model


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XC3S200-5PQG210C Attributes


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XC3S200-5PQG210C Overview



The chip model XC3S200-5PQG210C is a powerful integrated circuit (IC) designed for a wide range of applications from consumer electronics to industrial automation. It is a Field Programmable Gate Array (FPGA) with 200,000 logic cells and 5,000 DSP slices, making it one of the most powerful FPGAs on the market. The chip model is also equipped with advanced features such as high-speed transceivers, clock management, and memory controllers.


The chip model XC3S200-5PQG210C is becoming increasingly popular in the industry due to its versatility, power, and affordability. Its ability to be programmed to meet specific needs makes it ideal for a variety of applications, from automotive and medical to industrial automation and telecommunications. The chip model can be used to create a wide range of hardware and software solutions, as well as provide an efficient platform for developing and testing new ideas.


As technology continues to evolve, the chip model XC3S200-5PQG210C is expected to become even more popular in the industry. Its ability to be programmed to meet specific needs makes it ideal for applications in the era of fully intelligent systems. For example, it can be used to power networked systems, such as the Internet of Things (IoT), and provide the necessary processing power for artificial intelligence (AI) applications. Additionally, the chip model can be used to create intelligent scenarios in industrial automation, such as smart manufacturing, autonomous vehicles, and more.


The chip model XC3S200-5PQG210C is also expected to be used in new technologies, such as 5G networks, virtual reality, and augmented reality. As these technologies become more widespread, the chip model will be able to provide the necessary processing power to support them. Additionally, the chip model can be used to create solutions for the Internet of Things (IoT), such as sensors, actuators, and controllers, as well as provide the necessary processing power for AI applications.


In conclusion, the chip model XC3S200-5PQG210C is a powerful integrated circuit that is becoming increasingly popular in the industry due to its versatility, power, and affordability. It is expected to be used in a variety of applications in the future, from 5G networks to virtual reality and augmented reality. Additionally, the chip model can be used to create solutions for the Internet of Things (IoT) and provide the necessary processing power for AI applications. With its advanced features and ability to be programmed to meet specific needs, the chip model XC3S200-5PQG210C is expected to remain a powerful and popular integrated circuit in the future.



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