XC3S200-4FTG256I

The XC3S200-4FTG256I is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range device in the Spartan-3 family of FPGAs, and is based on the Xilinx Spartan-3E architecture. It has a capacity of 200K system gates, and contains 256 4-input Look-Up Tables (LUTs). It has a total of 12,288 Flip-Flops and 4,096 RAM blocks. It has a maximum I/O count of 144, and a maximum user I/O count of 136. The chip has a power dissipation of 1.2W.

The chip has a wide range of applications, including digital signal processing, embedded processor design, automotive, industrial, medical, and consumer applications. It is also suitable for use in a variety of communication systems, such as wireless, Ethernet, and Fibre Channel. It is designed to provide high performance, low power consumption, and low cost.

The XC3S200-4FTG256I has a total of 256 I/Os, which are divided into two banks. It has a total of two dedicated clock networks, and two dedicated global clocks. It has an operating temperature range of 0°C to 85°C. It is packaged in a 256-pin TQFP package, and is compatible with the Xilinx ISE design tools.

The XC3S200-4FTG256I is a powerful, low cost FPGA chip that can be used in a wide range of applications. It is designed to provide high performance, low power consumption, and low cost. It is also compatible with the Xilinx ISE design tools, making it easy to use for designers.