XC3S200-4FGG676C
XC3S200-4FGG676C
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rohs

AMD Xilinx

XC3S200-4FGG676C


XC3S200-4FGG676C
F20-XC3S200-4FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, LEAD FREE, FBGA-676
LEAD FREE, FBGA-676

XC3S200-4FGG676C ECAD Model


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XC3S200-4FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Equivalent Gates 50000
Number of CLBs 192
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 192 CLBS, 50000 GATES
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3S200-4FGG676C Datasheet Download


XC3S200-4FGG676C Overview



The Xilinx XC3S200-4FGG676C FPGA chip is a powerful and reliable device designed to meet the needs of advanced communication systems. It is a low-cost, high-performance, low-power FPGA chip that is suitable for a wide range of applications. This chip is designed to provide the user with a high degree of flexibility and scalability.


The XC3S200-4FGG676C FPGA chip is designed to provide a wide range of features and capabilities. It has a high-speed data transmission rate of up to 200 Mbps, and can support up to 4 channels of LVDS/LVCMOS I/Os. It also features a low-power design, which helps to reduce power consumption and extend battery life. Additionally, this chip is designed to be highly configurable, allowing for a wide range of customization options.


The XC3S200-4FGG676C FPGA chip is designed to meet the needs of advanced communication systems. It can be used for a variety of applications, including embedded system designs, digital signal processing, and communication systems. This chip can be used for a variety of tasks, such as video processing, audio processing, and data transmission. Additionally, it can be used for a variety of other applications, such as data storage and encryption.


The XC3S200-4FGG676C FPGA chip is also designed to be easily upgradable. It can be easily upgraded to a higher performance version of the chip, allowing for more advanced applications and features. Additionally, this chip can be used in the development and popularization of future intelligent robots. This chip can provide the necessary hardware and software support for the development of robotic systems.


In order to use the XC3S200-4FGG676C FPGA chip effectively, it is important to understand the specific design requirements and product description of the chip. Additionally, it is important to understand the actual case studies and precautions associated with the chip. Additionally, it is important to have the necessary technical skills and knowledge in order to effectively use the chip.


The XC3S200-4FGG676C FPGA chip is a powerful and reliable device designed to meet the needs of advanced communication systems. It is designed to provide a wide range of features and capabilities, as well as a high degree of flexibility and scalability. Additionally, this chip is designed to be easily upgradable, allowing for more advanced applications and features. Furthermore, this chip can be used in the development and popularization of future intelligent robots. In order to use the XC3S200-4FGG676C FPGA chip effectively, it is important to understand the specific design requirements and product description of the chip, as well as the actual case studies and precautions associated with the chip. Additionally, it is important to have the necessary technical skills and knowledge in order to effectively use the chip.



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Unit Price: $50.40
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Pricing (USD)

QTY Unit Price Ext Price
1+ $46.8720 $46.8720
10+ $46.3680 $463.6800
100+ $43.8480 $4,384.8000
1000+ $41.3280 $20,664.0000
10000+ $37.8000 $37,800.0000
The price is for reference only, please refer to the actual quotation!

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