
AMD Xilinx
XC3S200-4FGG676C
XC3S200-4FGG676C ECAD Model
XC3S200-4FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Equivalent Gates | 50000 | |
Number of CLBs | 192 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 192 CLBS, 50000 GATES | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XC3S200-4FGG676C Datasheet Download
XC3S200-4FGG676C Overview
The Xilinx XC3S200-4FGG676C FPGA chip is a powerful and reliable device designed to meet the needs of advanced communication systems. It is a low-cost, high-performance, low-power FPGA chip that is suitable for a wide range of applications. This chip is designed to provide the user with a high degree of flexibility and scalability.
The XC3S200-4FGG676C FPGA chip is designed to provide a wide range of features and capabilities. It has a high-speed data transmission rate of up to 200 Mbps, and can support up to 4 channels of LVDS/LVCMOS I/Os. It also features a low-power design, which helps to reduce power consumption and extend battery life. Additionally, this chip is designed to be highly configurable, allowing for a wide range of customization options.
The XC3S200-4FGG676C FPGA chip is designed to meet the needs of advanced communication systems. It can be used for a variety of applications, including embedded system designs, digital signal processing, and communication systems. This chip can be used for a variety of tasks, such as video processing, audio processing, and data transmission. Additionally, it can be used for a variety of other applications, such as data storage and encryption.
The XC3S200-4FGG676C FPGA chip is also designed to be easily upgradable. It can be easily upgraded to a higher performance version of the chip, allowing for more advanced applications and features. Additionally, this chip can be used in the development and popularization of future intelligent robots. This chip can provide the necessary hardware and software support for the development of robotic systems.
In order to use the XC3S200-4FGG676C FPGA chip effectively, it is important to understand the specific design requirements and product description of the chip. Additionally, it is important to understand the actual case studies and precautions associated with the chip. Additionally, it is important to have the necessary technical skills and knowledge in order to effectively use the chip.
The XC3S200-4FGG676C FPGA chip is a powerful and reliable device designed to meet the needs of advanced communication systems. It is designed to provide a wide range of features and capabilities, as well as a high degree of flexibility and scalability. Additionally, this chip is designed to be easily upgradable, allowing for more advanced applications and features. Furthermore, this chip can be used in the development and popularization of future intelligent robots. In order to use the XC3S200-4FGG676C FPGA chip effectively, it is important to understand the specific design requirements and product description of the chip, as well as the actual case studies and precautions associated with the chip. Additionally, it is important to have the necessary technical skills and knowledge in order to effectively use the chip.
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5,883 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $46.8720 | $46.8720 |
10+ | $46.3680 | $463.6800 |
100+ | $43.8480 | $4,384.8000 |
1000+ | $41.3280 | $20,664.0000 |
10000+ | $37.8000 | $37,800.0000 |
The price is for reference only, please refer to the actual quotation! |