XC3S200-4FG456C
XC3S200-4FG456C
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rohs

AMD Xilinx

XC3S200-4FG456C


XC3S200-4FG456C
F20-XC3S200-4FG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, FBGA-456
FBGA-456

XC3S200-4FG456C ECAD Model


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XC3S200-4FG456C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Equivalent Gates 50000
Number of CLBs 192
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 192 CLBS, 50000 GATES
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XC3S200-4FG456C Datasheet Download


XC3S200-4FG456C Overview



The XC3S200-4FG456C chip model is a high-performance, low-cost programmable logic device from Xilinx. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be programmed using the Hardware Description Language (HDL). This makes it easier for users to customize their applications and make the most of the chip's features.


The XC3S200-4FG456C chip model offers a number of advantages over other chip models. It has a wide range of programmable logic resources, including fast clock speeds, a high-performance CPU, and a range of memory options. It also provides excellent power efficiency, making it ideal for applications that require a low power consumption. Furthermore, the chip model is compatible with a number of popular operating systems, making it easy to integrate into existing systems.


The XC3S200-4FG456C chip model is expected to experience a surge in demand in the near future, as more industries look to benefit from its features. In particular, the chip model is likely to be used in the development and popularization of future intelligent robots, as it provides the necessary features and performance to support the highly complex tasks that these robots will be required to perform.


In order to use the XC3S200-4FG456C chip model effectively, certain technical talents are required. These include a good understanding of HDL, as well as the ability to program the chip model to carry out specific tasks. Additionally, knowledge of operating systems and their integration with the chip model is also important, as this will allow users to make the most of the chip's features. Finally, expertise in robotics and artificial intelligence is also necessary, as these will be key components of future intelligent robots.



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Unit Price: $13.92
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Pricing (USD)

QTY Unit Price Ext Price
1+ $12.9456 $12.9456
10+ $12.8064 $128.0640
100+ $12.1104 $1,211.0400
1000+ $11.4144 $5,707.2000
10000+ $10.4400 $10,440.0000
The price is for reference only, please refer to the actual quotation!

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