XC3S1600E-4FG320IS1
XC3S1600E-4FG320IS1
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rohs

AMD Xilinx

XC3S1600E-4FG320IS1


XC3S1600E-4FG320IS1
F20-XC3S1600E-4FG320IS1
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-320
FBGA-320

XC3S1600E-4FG320IS1 ECAD Model


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XC3S1600E-4FG320IS1 Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 250
Number of Outputs 194
Number of Logic Cells 33192
Number of Equivalent Gates 1600000
Number of CLBs 3688
Combinatorial Delay of a CLB-Max 760 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 3688 CLBS, 1600000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B320
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 320
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-320
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S1600E-4FG320IS1 Datasheet Download


XC3S1600E-4FG320IS1 Overview



The XC3S1600E-4FG320IS1 is a powerful chip model that is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be used with the HDL (Hardware Description Language) for programming. This chip model is capable of providing high-speed operations and is therefore ideal for applications that require high performance.


In terms of its possible future applications, the XC3S1600E-4FG320IS1 can be used in networks and intelligent scenarios. This chip model can be used in the era of fully intelligent systems, as it is capable of handling complex operations and tasks. This chip model can be used for artificial intelligence, machine learning, natural language processing, and more. Additionally, this chip model can be used for robotics, autonomous vehicles, and other applications that require high-speed operations.


The product description and specific design requirements of the XC3S1600E-4FG320IS1 are as follows: It is a high-performance chip model that is designed to be used with HDL language. It has a maximum clock frequency of 320 MHz and is capable of providing up to 8.3 GFLOPS of compute performance. It is also equipped with a Xilinx Spartan-6 FPGA that has 4,320 logic cells and 48 DSP slices. Additionally, it has an on-board memory controller, which supports up to 32MB of external memory.


In terms of actual case studies and precautions, the XC3S1600E-4FG320IS1 has been used in various projects, such as in the development of autonomous vehicles. It was used to provide the necessary computational power for the vehicle's AI-based navigation system. Additionally, it was used in the development of a robotic arm that was capable of performing complex tasks.


In terms of precautions, it is important to ensure that the chip model is programmed correctly and that all necessary safety measures are taken. Additionally, it is important to ensure that the chip model is used for its intended purpose and that it is not used for any illegal activities. Lastly, it is important to ensure that the chip model is used in an environment that is free from any potential hazards.



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Unit Price: $210.7404
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Pricing (USD)

QTY Unit Price Ext Price
1+ $195.9886 $195.9886
10+ $193.8812 $1,938.8117
100+ $183.3441 $18,334.4148
1000+ $172.8071 $86,403.5640
10000+ $158.0553 $158,055.3000
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