
AMD Xilinx
XC3S1400AN-5FG676C
XC3S1400AN-5FG676C ECAD Model
XC3S1400AN-5FG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 502 | |
Number of Outputs | 408 | |
Number of Logic Cells | 25344 | |
Number of Equivalent Gates | 1400000 | |
Number of CLBs | 2816 | |
Combinatorial Delay of a CLB-Max | 620 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2816 CLBS, 1400000 GATES | |
Clock Frequency-Max | 770 MHz | |
Power Supplies | 1.2,1.2/3.3,3.3 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.44 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-676 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 676 |
XC3S1400AN-5FG676C Datasheet Download
XC3S1400AN-5FG676C Overview
The XC3S1400AN-5FG676C is a powerful and versatile chip model that is suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language and is capable of handling complex tasks. The chip model is suitable for networks, intelligent scenarios, and can be used in the era of fully intelligent systems.
The XC3S1400AN-5FG676C is a powerful chip model that is designed to meet the requirements of high-performance digital signal processing, embedded processing, and image processing applications. It is based on the Xilinx Spartan-3E FPGA family and is equipped with a wide range of features that are suitable for a variety of applications. It is capable of handling complex tasks and is designed to be used with HDL language.
The chip model is suitable for networks, intelligent scenarios, and can be used in the era of fully intelligent systems. It is capable of providing high-speed data processing, real-time communication, and reliable data storage. It has the ability to process data quickly and accurately, and can be used for a variety of applications, including image processing, video processing, and audio processing.
The product description and specific design requirements of the chip model XC3S1400AN-5FG676C should be thoroughly understood before its use. In order to ensure the successful implementation of the chip model, the user should be familiar with the Xilinx Spartan-3E FPGA family and the HDL language. Furthermore, the user should also be aware of the design considerations, such as power consumption, clock speed, and memory requirements.
To get a better understanding of the chip model XC3S1400AN-5FG676C, actual case studies and precautions should be taken into account. By studying the actual case studies, users can gain a better understanding of the chip model and its capabilities. Furthermore, precautions should be taken to ensure that the chip model is used in an appropriate manner.
In conclusion, the XC3S1400AN-5FG676C is a powerful and versatile chip model that is suitable for a variety of high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language and is capable of handling complex tasks. The chip model is suitable for networks, intelligent scenarios, and can be used in the era of fully intelligent systems. The product description and specific design requirements of the chip model XC3S1400AN-5FG676C should be thoroughly understood before its use, and actual case studies and precautions should be taken into account.
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5,085 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $180.2764 | $180.2764 |
10+ | $178.3380 | $1,783.3795 |
100+ | $168.6457 | $16,864.5672 |
1000+ | $158.9534 | $79,476.6960 |
10000+ | $145.3842 | $145,384.2000 |
The price is for reference only, please refer to the actual quotation! |