XC3S1400AN-4FGG484I

The XC3S1400AN-4FGG484I is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a mid-range device in the Spartan-3E family, with a maximum operating frequency of 200 MHz. This chip model has 4,096 logic cells, 4,000 flip-flops, and 64Kbits of block RAM. It also features two digital clock managers (DCMs) and two clock multiplier units (CMUs).

The chip has 459 user I/O pins, and can support both 3.3V and 5V I/O standards. It has a total power dissipation of 3.2W, with a maximum junction temperature of 85°C. It is available in a 484-pin fine-pitch Ball Grid Array (BGA) package.

The XC3S1400AN-4FGG484I chip model is suitable for a wide range of applications, such as automotive, consumer electronics, industrial automation, medical, and military/aerospace. It can be used for high-speed data acquisition, image processing, video processing, audio processing, and communications. It is also suitable for applications that require high-speed signal processing, low power dissipation, and high reliability.