XC3S1400AN-4FGG484C
XC3S1400AN-4FGG484C
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AMD Xilinx

XC3S1400AN-4FGG484C


XC3S1400AN-4FGG484C
F20-XC3S1400AN-4FGG484C
Active
IC FPGA 372 I/O 484FBGA
484-FBGA (23x23)

XC3S1400AN-4FGG484C ECAD Model


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XC3S1400AN-4FGG484C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3AN
Package Tray
Number of LABs/CLBs 2816
Number of Logic Elements/Cells 25344
Total RAM Bits 589824
Number of I/O 372
Number of Gates 1400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number XC3S1400AN

XC3S1400AN-4FGG484C Datasheet Download


XC3S1400AN-4FGG484C Overview



The XC3S1400AN-4FGG484C is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx Inc. It is a low-cost, low-power device that is suitable for a wide range of applications.


The XC3S1400AN-4FGG484C is a Spartan-3E FPGA that is based on the Xilinx Spartan-3E family of devices. It has a total of 4,848 logic cells, 4,800 flip-flops, and 400Kbits of embedded RAM. It also has a total of 144 user I/O pins and a total of 14 dedicated clock pins. The device is also equipped with an integrated PowerPC 405 processor and an integrated 16-bit multipliers.


The XC3S1400AN-4FGG484C has a maximum operating frequency of 200MHz and a maximum power consumption of 2.5W. It is also equipped with a JTAG port for programming and debugging, and a SPI port for configuration.


The XC3S1400AN-4FGG484C is suitable for a wide range of applications, including embedded control, industrial automation, automotive and consumer electronics, as well as medical and military applications. It is also suitable for high-speed data processing and signal processing applications. It is also suitable for applications requiring high levels of integration, such as video and image processing.



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