XC3S1400AN-4FG484I
XC3S1400AN-4FG484I
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AMD Xilinx

XC3S1400AN-4FG484I


XC3S1400AN-4FG484I
F20-XC3S1400AN-4FG484I
Active
IC FPGA 372 I/O 484FBGA
484-FBGA (23x23)

XC3S1400AN-4FG484I ECAD Model


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XC3S1400AN-4FG484I Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3AN
Package Tray
Number of LABs/CLBs 2816
Number of Logic Elements/Cells 25344
Total RAM Bits 589824
Number of I/O 372
Number of Gates 1400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number XC3S1400AN

XC3S1400AN-4FG484I Datasheet Download


XC3S1400AN-4FG484I Overview



The XC3S1400AN-4FG484I is a single-chip Field Programmable Gate Array (FPGA) from Xilinx. It is based on the Spartan-3A architecture, and is designed to provide a low-cost, low-power solution for a wide variety of applications. It has a total of 4,096 logic cells, and can be used to implement digital logic functions, as well as memory, DSP and other functions.


The XC3S1400AN-4FG484I has a total of 484 I/O pins, organized into two banks. The first bank has 296 I/O pins, and the second bank has 188 I/O pins. The pins are organized into three voltage-tolerant I/O standards: LVTTL, LVCMOS and GTL. The chip also includes two dedicated clock inputs, and two dedicated clock outputs.


The XC3S1400AN-4FG484I is capable of running at speeds up to 200 MHz, and has a maximum operating temperature of 85°C. It also has a power consumption of 1.2W, making it an ideal choice for low-power applications.


The XC3S1400AN-4FG484I can be used in a variety of applications, including embedded systems, communications systems, automotive systems, consumer electronics, and industrial automation. It is also well-suited for applications that require low-power, low-cost solutions, such as medical devices and portable electronics.



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