
AMD Xilinx
XC3S1400AN-4FG484I
XC3S1400AN-4FG484I ECAD Model
XC3S1400AN-4FG484I Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Spartan®-3AN | |
Package | Tray | |
Number of LABs/CLBs | 2816 | |
Number of Logic Elements/Cells | 25344 | |
Total RAM Bits | 589824 | |
Number of I/O | 372 | |
Number of Gates | 1400000 | |
Voltage - Supply | 1.14V ~ 1.26V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C (TJ) | |
Package / Case | 484-BBGA | |
Supplier Device Package | 484-FBGA (23x23) | |
Base Product Number | XC3S1400AN |
XC3S1400AN-4FG484I Datasheet Download
XC3S1400AN-4FG484I Overview
The XC3S1400AN-4FG484I is a single-chip Field Programmable Gate Array (FPGA) from Xilinx. It is based on the Spartan-3A architecture, and is designed to provide a low-cost, low-power solution for a wide variety of applications. It has a total of 4,096 logic cells, and can be used to implement digital logic functions, as well as memory, DSP and other functions.
The XC3S1400AN-4FG484I has a total of 484 I/O pins, organized into two banks. The first bank has 296 I/O pins, and the second bank has 188 I/O pins. The pins are organized into three voltage-tolerant I/O standards: LVTTL, LVCMOS and GTL. The chip also includes two dedicated clock inputs, and two dedicated clock outputs.
The XC3S1400AN-4FG484I is capable of running at speeds up to 200 MHz, and has a maximum operating temperature of 85°C. It also has a power consumption of 1.2W, making it an ideal choice for low-power applications.
The XC3S1400AN-4FG484I can be used in a variety of applications, including embedded systems, communications systems, automotive systems, consumer electronics, and industrial automation. It is also well-suited for applications that require low-power, low-cost solutions, such as medical devices and portable electronics.
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