XC3S1400AN-4FG484C
XC3S1400AN-4FG484C
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rohs

AMD Xilinx

XC3S1400AN-4FG484C


XC3S1400AN-4FG484C
F20-XC3S1400AN-4FG484C
Active
IC FPGA 372 I/O 484FBGA
484-FBGA (23x23)

XC3S1400AN-4FG484C ECAD Model


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XC3S1400AN-4FG484C Attributes


Type Description Select
Mfr AMD Xilinx
Series Spartan®-3AN
Package Tray
Number of LABs/CLBs 2816
Number of Logic Elements/Cells 25344
Total RAM Bits 589824
Number of I/O 372
Number of Gates 1400000
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Base Product Number XC3S1400AN

XC3S1400AN-4FG484C Datasheet Download


XC3S1400AN-4FG484C Overview



The XC3S1400AN-4FG484C is a field-programmable gate array (FPGA) chip from Xilinx. It is designed for low-cost, low-power applications, and is ideal for applications requiring high performance and low power consumption.


The chip features a Spartan-3AN FPGA architecture with 4K logic cells and up to 4 Mbits of block RAM. It has 28 dedicated high-speed transceivers and a wide range of I/O options. It also has a range of advanced features such as advanced power management, advanced clocking, and advanced system integration.


The XC3S1400AN-4FG484C is suitable for a wide range of applications, including embedded systems, industrial automation, communication systems, medical systems, and more. It is a cost-effective solution for applications requiring high performance and low power consumption.


The chip is compliant with the JEDEC standard and is also RoHS compliant. It is available in a 484-pin BGA package and is suitable for a wide range of temperatures, from -40°C to +85°C.


In summary, the XC3S1400AN-4FG484C is a low-cost, low-power FPGA chip from Xilinx. It features 4K logic cells, 28 dedicated transceivers, and a wide range of I/O options. It is suitable for a wide range of applications and is available in a 484-pin BGA package.



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