AMD Xilinx
XC3S1400A-5FT256C
XC3S1400A-5FT256C ECAD Model
XC3S1400A-5FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 161 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 25344 | |
| Number of Equivalent Gates | 1400000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 620 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 1400000 GATES | |
| Clock Frequency-Max | 770 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S1400A-5FT256C Datasheet Download
XC3S1400A-5FT256C Overview
The chip model XC3S1400A-5FT256C is a revolutionary technology in the field of semiconductor chips. It is a field-programmable gate array (FPGA) and provides a wide range of features and benefits, such as high speed and low power consumption. It is also a cost-effective solution that can be used in a variety of applications.
The chip model XC3S1400A-5FT256C has been widely used in the industry and is expected to continue to be popular in the future. The chip can be used for a variety of applications, including data processing, signal processing, and embedded systems. It is also suitable for use in networks and can provide a reliable connection between different devices.
The chip model XC3S1400A-5FT256C is also capable of supporting a wide range of new technologies. It can be used for applications such as machine learning, artificial intelligence, and natural language processing. It can also be used to support the development of intelligent systems, such as autonomous vehicles, robots, and smart homes.
The chip model XC3S1400A-5FT256C is a powerful and cost-effective solution that can be used in a variety of industries. It is expected to continue to be popular in the future, as it can provide a reliable connection between different devices and support the development of new technologies. It is also suitable for use in networks and can be used in the era of fully intelligent systems. With its wide range of features and benefits, the chip model XC3S1400A-5FT256C is expected to remain a popular choice for many applications in the future.
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5,186 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $55.8298 | $55.8298 |
| 10+ | $55.2294 | $552.2944 |
| 100+ | $52.2278 | $5,222.7840 |
| 1000+ | $49.2262 | $24,613.1200 |
| 10000+ | $45.0240 | $45,024.0000 |
| The price is for reference only, please refer to the actual quotation! | ||