AMD Xilinx
XC3S1400A-4FT256C
XC3S1400A-4FT256C ECAD Model
XC3S1400A-4FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 161 | |
| Number of Outputs | 148 | |
| Number of Logic Cells | 25344 | |
| Number of Equivalent Gates | 1400000 | |
| Number of CLBs | 2816 | |
| Combinatorial Delay of a CLB-Max | 710 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2816 CLBS, 1400000 GATES | |
| Clock Frequency-Max | 667 MHz | |
| Power Supplies | 1.2,1.2/3.3,3.3 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FTBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S1400A-4FT256C Datasheet Download
XC3S1400A-4FT256C Overview
The XC3S1400A-4FT256C chip model is a powerful integrated circuit designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It requires the use of HDL language, a hardware description language that allows for the design and implementation of complex digital systems.
The original design intention of the XC3S1400A-4FT256C chip model was to provide a powerful and reliable platform for a variety of applications. It is also designed to be easily upgradeable, allowing for future expansion and improvement. This makes it an ideal choice for advanced communication systems, as it can be adapted to meet the ever-changing needs of the industry.
The XC3S1400A-4FT256C chip model is also a great choice for the development and popularization of future intelligent robots. It has the power and flexibility to handle a variety of tasks, from navigation and obstacle avoidance to facial recognition and voice recognition. To use the model effectively, technical talents such as computer engineers, electrical engineers, and software engineers are needed.
In conclusion, the XC3S1400A-4FT256C chip model is a powerful integrated circuit that can be used for a variety of applications. It is designed to be easily upgradeable and can be used for advanced communication systems and the development of future intelligent robots. To use the model effectively, technical talents such as computer engineers, electrical engineers, and software engineers are needed.
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4,987 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $46.5074 | $46.5074 |
| 10+ | $46.0074 | $460.0736 |
| 100+ | $43.5070 | $4,350.6960 |
| 1000+ | $41.0066 | $20,503.2800 |
| 10000+ | $37.5060 | $37,506.0000 |
| The price is for reference only, please refer to the actual quotation! | ||