XC3S1400A-4FG676C

The XC3S1400A-4FG676C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is part of the Spartan-3A family, and is ideal for low-cost, low-power applications. The chip is available in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package.

The XC3S1400A-4FG676C offers a total of 1,400 logic cells, with a total of 1.8 million system gates. It also has up to 4,608 flip-flops and 1,152 I/O pins. The chip is designed to operate at a maximum speed of 200 MHz, and has an internal clock frequency of up to 400 MHz. It has a power consumption of 1.5 W and a maximum operating temperature of 85°C.

The XC3S1400A-4FG676C is suitable for a wide range of applications such as high-speed data acquisition, communication systems, motor control systems, audio and video processing, and embedded systems. It is also suitable for applications such as medical imaging, industrial control, and automotive systems. The chip offers a wide range of features, including clock management, power management, high-speed transceivers, and configurable logic blocks.

Overall, the XC3S1400A-4FG676C is a powerful and reliable FPGA chip designed for low-cost and low-power applications. It offers a wide range of features, and is suitable for a wide range of applications.