XC3S1200E-6FGG400C
XC3S1200E-6FGG400C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3S1200E-6FGG400C


XC3S1200E-6FGG400C
F20-XC3S1200E-6FGG400C
Active
BGA

XC3S1200E-6FGG400C ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3S1200E-6FGG400C Attributes


Type Description Select

XC3S1200E-6FGG400C Overview



The chip model XC3S1200E-6FGG400C is a high-performance, low-power FPGA device that is widely used in a variety of applications. It is designed to meet the needs of modern communication systems and networks, providing users with a cost-effective solution for their specific needs.


The XC3S1200E-6FGG400C chip model is a versatile, reliable and cost-effective solution for a variety of applications. It is designed to provide users with a high-performance and low-power solution that is well-suited for a variety of applications. With its advanced features, the XC3S1200E-6FGG400C chip model is able to support a wide range of applications, including high-speed communication systems, intelligent networks, and advanced intelligent systems.


When it comes to industry trends, the XC3S1200E-6FGG400C chip model is designed to be flexible and upgradeable. It is designed to meet the needs of the future, and can be upgraded to meet the demands of new technologies. This allows users to stay up to date with the latest technology trends and keep their applications running smoothly.


The XC3S1200E-6FGG400C chip model is a powerful tool for advanced communication systems, intelligent networks, and intelligent systems. It is designed to be used in the era of fully intelligent systems, providing users with the ability to create complex and sophisticated applications. It is also capable of being used in a variety of scenarios, including wireless networks, industrial automation, and Internet of Things (IoT).


In conclusion, the XC3S1200E-6FGG400C chip model is a versatile and reliable solution for a variety of applications. It is designed to meet the needs of modern communication systems, networks, and intelligent systems, providing users with a cost-effective solution for their specific needs. It is also designed to be flexible and upgradeable, allowing users to stay up to date with the latest technology trends and keep their applications running smoothly. With its advanced features, the XC3S1200E-6FGG400C chip model is able to support a wide range of applications, including high-speed communication systems, intelligent networks, and advanced intelligent systems.



2,558 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote