AMD Xilinx
XC3S100E-5VQ100C
XC3S100E-5VQ100C ECAD Model
XC3S100E-5VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 66 | |
| Number of Outputs | 59 | |
| Number of Logic Cells | 2160 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 240 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 240 CLBS, 100000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e4 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | NICKEL PALLADIUM GOLD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S100E-5VQ100C Datasheet Download
XC3S100E-5VQ100C Overview
The XC3S100E-5VQ100C chip model was designed to meet the needs of a wide range of applications, from basic communication systems to advanced communication systems. This model is based on the FPGA (Field Programmable Gate Array) architecture, which allows for high speed, low power consumption, and flexibility. This chip model is capable of running complex algorithms, making it suitable for a variety of applications.
The XC3S100E-5VQ100C can be applied to a variety of networks, such as wireless networks, cellular networks, and satellite networks. It is also suitable for intelligent scenarios such as facial recognition, voice recognition, and natural language processing. The chip model has the capability to process large amounts of data quickly and accurately, making it an ideal choice for the development and popularization of future intelligent robots.
In order to effectively use the XC3S100E-5VQ100C chip model, technical talents such as software engineers, electrical engineers, and computer scientists are needed. These experts are needed to develop the algorithms and programs that will be used to control the chip model. They must also be familiar with the hardware and software architecture of the chip model in order to ensure that the model is effectively utilized.
The XC3S100E-5VQ100C chip model is a versatile and powerful option for a wide range of applications. Its ability to process large amounts of data quickly and accurately makes it suitable for a variety of networks, intelligent scenarios, and the development and popularization of future intelligent robots. With the right technical talents, this chip model can be used to its full potential and help bring the future of fully intelligent systems to life.
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1,401 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $25.1809 | $25.1809 |
| 10+ | $24.9101 | $249.1010 |
| 100+ | $23.5563 | $2,355.6294 |
| 1000+ | $22.2025 | $11,101.2420 |
| 10000+ | $20.3072 | $20,307.1500 |
| The price is for reference only, please refer to the actual quotation! | ||