AMD Xilinx
XC3S100E-5CPG132C
XC3S100E-5CPG132C ECAD Model
XC3S100E-5CPG132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 83 | |
| Number of Outputs | 72 | |
| Number of Logic Cells | 2160 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 240 | |
| Combinatorial Delay of a CLB-Max | 660 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 240 CLBS, 100000 GATES | |
| Clock Frequency-Max | 657 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC3S100E-5CPG132C Datasheet Download
XC3S100E-5CPG132C Overview
The XC3S100E-5CPG132C chip model is a powerful processor for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it a versatile and reliable processor for a variety of applications.
The future of the chip model XC3S100E-5CPG132C and related industries depends on what specific technologies are needed. As technology advances, the chip model may need to be updated to include new features or technologies to remain competitive in the market. For example, the chip model may need to be updated to include artificial intelligence or machine learning capabilities to meet the demands of the market.
The chip model XC3S100E-5CPG132C can be applied to the development and popularization of future intelligent robots. To use the model effectively, technical talents such as software engineers, hardware engineers, and artificial intelligence experts are needed. These experts will be able to program the chip model to perform a variety of tasks, such as recognizing objects, understanding voice commands, and making decisions. With the help of these experts, the chip model can be used to create sophisticated robots that can perform complex tasks.
In conclusion, the XC3S100E-5CPG132C chip model is a powerful processor for high-performance digital signal processing, embedded processing, and image processing. It can be used to develop and popularize future intelligent robots, but requires the support of technical talents to use it effectively. The future of the chip model and related industries depend on what specific technologies are needed. As technology advances, the chip model may need to be updated to include new features or technologies to remain competitive in the market.
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4,645 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13.8533 | $13.8533 |
| 10+ | $13.7043 | $137.0432 |
| 100+ | $12.9595 | $1,295.9520 |
| 1000+ | $12.2147 | $6,107.3600 |
| 10000+ | $11.1720 | $11,172.0000 |
| The price is for reference only, please refer to the actual quotation! | ||