AMD Xilinx
XC3S100E-4CP132I
XC3S100E-4CP132I ECAD Model
XC3S100E-4CP132I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 83 | |
| Number of Outputs | 72 | |
| Number of Logic Cells | 2160 | |
| Number of Equivalent Gates | 100000 | |
| Number of CLBs | 240 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 240 CLBS, 100000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC3S100E-4CP132I Datasheet Download
XC3S100E-4CP132I Overview
The XC3S100E-4CP132I chip model is a versatile, high-performance model that is suitable for a variety of applications, including digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a powerful tool for designing and programming digital circuits.
The XC3S100E-4CP132I chip model offers a number of advantages over other models. It is highly efficient, with a low power consumption and high clock speeds. It is also highly reliable, with a long lifespan and low failure rate. Furthermore, it is compatible with a range of operating systems and development environments, making it easier to integrate into existing systems.
The demand for the XC3S100E-4CP132I chip model is expected to grow in the coming years. This is because it is an ideal choice for a variety of applications, such as medical devices, automotive electronics, and industrial automation. Furthermore, as the demand for intelligent robots grows, the need for powerful and reliable processors is likely to increase as well.
The XC3S100E-4CP132I chip model can be used effectively in the development and popularization of future intelligent robots. It is powerful enough to handle complex tasks, and its low power consumption and high clock speeds make it suitable for use in robots. To use the model effectively, developers must be familiar with the HDL language, as well as with other programming languages such as C and Python. Additionally, they should have a good understanding of robotics and artificial intelligence, as these are essential when designing and programming robots.
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2,586 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $17.2906 | $17.2906 |
| 10+ | $17.1046 | $171.0464 |
| 100+ | $16.1750 | $1,617.5040 |
| 1000+ | $15.2454 | $7,622.7200 |
| 10000+ | $13.9440 | $13,944.0000 |
| The price is for reference only, please refer to the actual quotation! | ||