AMD Xilinx
XC3S1000L-4FT256C
XC3S1000L-4FT256C ECAD Model
XC3S1000L-4FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 173 | |
| Number of Outputs | 173 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1920 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1000000 GATES | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 1.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FTBGA-256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 256 |
XC3S1000L-4FT256C Datasheet Download
XC3S1000L-4FT256C Overview
The XC3S1000L-4FT256C chip model is a powerful and versatile integrated circuit designed for high-performance digital signal processing, embedded processing, image processing and other applications. It is based on the Xilinx Spartan-3E field programmable gate array architecture and is programmed with a high-level HDL language. This chip model is ideal for applications where flexibility and performance are paramount.
The original design intention of the XC3S1000L-4FT256C was to provide a powerful and flexible platform for a wide range of applications. The chip model was designed to be upgradeable, allowing for the addition of new features and capabilities as needed. This makes it an ideal choice for applications that require high performance and flexibility.
The XC3S1000L-4FT256C can be used in advanced communication systems, such as wireless networks and satellite systems. It is also suitable for use in intelligent systems, such as robotics and artificial intelligence. It can be used in a variety of scenarios, including machine learning, data analysis, and image processing. The chip model is also capable of supporting the latest technologies, such as 5G and Internet of Things.
The XC3S1000L-4FT256C is a powerful and versatile integrated circuit that is capable of providing the necessary performance and flexibility for a wide range of applications. It is suitable for use in advanced communication systems, intelligent systems, and the latest technologies. It is an ideal choice for applications that require high performance and flexibility, and can be used in the era of fully intelligent systems.
You May Also Be Interested In
2,610 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $37.2000 | $37.2000 |
| 10+ | $36.8000 | $368.0000 |
| 100+ | $34.8000 | $3,480.0000 |
| 1000+ | $32.8000 | $16,400.0000 |
| 10000+ | $30.0000 | $30,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||