AMD Xilinx
XC3S1000L-4FG456C
XC3S1000L-4FG456C ECAD Model
XC3S1000L-4FG456C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 333 | |
| Number of Outputs | 333 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1920 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1000000 GATES | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S1000L-4FG456C Datasheet Download
XC3S1000L-4FG456C Overview
The chip model XC3S1000L-4FG456C is a revolutionary development in the field of microelectronics, and its potential applications in related industries are far-reaching. The model is a Field Programmable Gate Array (FPGA) with a maximum capacity of 1000 Logic Cells, making it a powerful and reliable option for a wide range of applications. It has a low power consumption, making it suitable for use in battery-powered devices, and it also has a high level of integration, allowing for multiple functions to be performed on a single chip.
The XC3S1000L-4FG456C is an ideal choice for companies looking to develop new products or services that require complex logic functions. It is also suitable for applications that require high-speed data processing, as it can be programmed to perform multiple operations simultaneously. Furthermore, the chip model is highly scalable and can be used in a variety of applications, from consumer electronics to industrial automation.
The chip model XC3S1000L-4FG456C is expected to be in high demand in the coming years, as its features make it an attractive choice for a wide range of applications. In particular, the model is likely to be used in the development and popularization of future intelligent robots. Its high level of integration and scalability make it an ideal choice for creating sophisticated robotic systems that can be used in a variety of environments.
In order to effectively use the XC3S1000L-4FG456C, companies and developers will need to be proficient in a variety of technologies, including FPGA programming, digital signal processing, and embedded systems design. Furthermore, they will need to be familiar with the XC3S1000L-4FG456C's specific features, such as its low power consumption, high level of integration, and scalability.
In conclusion, the XC3S1000L-4FG456C chip model is an exciting development in the field of microelectronics, and its potential applications in related industries are vast. Companies and developers looking to use the model effectively will need to be proficient in a variety of technologies and familiar with the XC3S1000L-4FG456C's specific features. Furthermore, the model is expected to be in high demand in the coming years, as its features make it an attractive choice for a wide range of applications, particularly in the development and popularization of future intelligent robots.
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2,250 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||