
AMD Xilinx
XC3S1000L-4FG320C
XC3S1000L-4FG320C ECAD Model
XC3S1000L-4FG320C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 221 | |
Number of Outputs | 221 | |
Number of Logic Cells | 17280 | |
Number of Equivalent Gates | 1000000 | |
Number of CLBs | 1920 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1920 CLBS, 1000000 GATES | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
JESD-30 Code | S-PBGA-B320 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 320 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA320,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | FBGA-320 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 320 |
XC3S1000L-4FG320C Datasheet Download
XC3S1000L-4FG320C Overview
XC3S1000L-4FG320C is a chip model from Xilinx, one of the leading providers of programmable logic devices. It is a low-cost, low-power FPGA with a Spartan-3E architecture. It is designed for applications such as embedded control, signal processing, and communications. The XC3S1000L-4FG320C is an ideal choice for applications that require low power, high performance, and low cost.
The XC3S1000L-4FG320C offers several advantages, such as a wide range of user-programmable logic, high performance, low power consumption, and low cost. The chip model also offers a wide range of I/O options, including LVDS, LVCMOS, and differential I/O. It also offers a wide range of memory options, including on-chip memory, external memory, and memory expansion. Additionally, the XC3S1000L-4FG320C offers a comprehensive set of features for embedded control, signal processing, and communication applications.
The XC3S1000L-4FG320C is expected to be in high demand in the future, as more and more applications require low power, high performance, and low cost. The chip model is expected to be used in a wide range of applications, including automotive, industrial, medical, and consumer electronics. Additionally, the XC3S1000L-4FG320C is expected to be used in advanced communication systems, such as 5G and IoT.
The original design intention of the XC3S1000L-4FG320C was to provide a low-cost, low-power, and high-performance FPGA solution for embedded control, signal processing, and communication applications. The chip model is designed to be easily upgradable, allowing users to add new features and capabilities as needed. Additionally, the XC3S1000L-4FG320C can be used in advanced communication systems, such as 5G and IoT.
The XC3S1000L-4FG320C is an ideal choice for applications that require low power, high performance, and low cost. The chip model offers a wide range of features and capabilities, and is expected to be in high demand in the future. Additionally, the XC3S1000L-4FG320C is designed to be easily upgradable, allowing users to add new features and capabilities as needed. As such, the XC3S1000L-4FG320C is well-suited for applications that require the support of new technologies.
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2,710 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $33.9986 | $33.9986 |
10+ | $33.6330 | $336.3299 |
100+ | $31.8051 | $3,180.5112 |
1000+ | $29.9772 | $14,988.6160 |
10000+ | $27.4182 | $27,418.2000 |
The price is for reference only, please refer to the actual quotation! |