XC3S1000L-4FG320C
XC3S1000L-4FG320C
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rohs

AMD Xilinx

XC3S1000L-4FG320C


XC3S1000L-4FG320C
F20-XC3S1000L-4FG320C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-320
FBGA-320

XC3S1000L-4FG320C ECAD Model


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XC3S1000L-4FG320C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 221
Number of Outputs 221
Number of Logic Cells 17280
Number of Equivalent Gates 1000000
Number of CLBs 1920
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1920 CLBS, 1000000 GATES
Power Supplies 1.2,1.2/3.3,2.5 V
JESD-30 Code S-PBGA-B320
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 320
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Package Description FBGA-320
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 320

XC3S1000L-4FG320C Datasheet Download


XC3S1000L-4FG320C Overview



XC3S1000L-4FG320C is a chip model from Xilinx, one of the leading providers of programmable logic devices. It is a low-cost, low-power FPGA with a Spartan-3E architecture. It is designed for applications such as embedded control, signal processing, and communications. The XC3S1000L-4FG320C is an ideal choice for applications that require low power, high performance, and low cost.


The XC3S1000L-4FG320C offers several advantages, such as a wide range of user-programmable logic, high performance, low power consumption, and low cost. The chip model also offers a wide range of I/O options, including LVDS, LVCMOS, and differential I/O. It also offers a wide range of memory options, including on-chip memory, external memory, and memory expansion. Additionally, the XC3S1000L-4FG320C offers a comprehensive set of features for embedded control, signal processing, and communication applications.


The XC3S1000L-4FG320C is expected to be in high demand in the future, as more and more applications require low power, high performance, and low cost. The chip model is expected to be used in a wide range of applications, including automotive, industrial, medical, and consumer electronics. Additionally, the XC3S1000L-4FG320C is expected to be used in advanced communication systems, such as 5G and IoT.


The original design intention of the XC3S1000L-4FG320C was to provide a low-cost, low-power, and high-performance FPGA solution for embedded control, signal processing, and communication applications. The chip model is designed to be easily upgradable, allowing users to add new features and capabilities as needed. Additionally, the XC3S1000L-4FG320C can be used in advanced communication systems, such as 5G and IoT.


The XC3S1000L-4FG320C is an ideal choice for applications that require low power, high performance, and low cost. The chip model offers a wide range of features and capabilities, and is expected to be in high demand in the future. Additionally, the XC3S1000L-4FG320C is designed to be easily upgradable, allowing users to add new features and capabilities as needed. As such, the XC3S1000L-4FG320C is well-suited for applications that require the support of new technologies.



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Unit Price: $36.5576
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Pricing (USD)

QTY Unit Price Ext Price
1+ $33.9986 $33.9986
10+ $33.6330 $336.3299
100+ $31.8051 $3,180.5112
1000+ $29.9772 $14,988.6160
10000+ $27.4182 $27,418.2000
The price is for reference only, please refer to the actual quotation!

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