XC3S1000-5FT256I
XC3S1000-5FT256I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC3S1000-5FT256I


XC3S1000-5FT256I
F20-XC3S1000-5FT256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA

XC3S1000-5FT256I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC3S1000-5FT256I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 173
Number of Outputs 173
Number of Logic Cells 17280
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.2,1.2/3.3,2.5 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S1000-5FT256I Datasheet Download


XC3S1000-5FT256I Overview



The XC3S1000-5FT256I chip model is a cutting-edge product that has been developed by Xilinx, Inc. It is a field-programmable gate array (FPGA) that is designed for high-performance applications. This chip model offers significant advantages over the previous generations of FPGAs, such as increased speed, lower power consumption, and greater flexibility.


The XC3S1000-5FT256I chip model is designed to be used in a variety of industries, including automotive, industrial, and medical. Its features make it ideal for applications that require high performance and low power consumption. The chip model is also suitable for use in advanced communication systems, such as 5G networks.


The XC3S1000-5FT256I chip model is expected to experience an increasing demand in the future, as more industries and applications require high-performance FPGAs. The chip model is also expected to be upgraded in the future, as Xilinx continues to innovate and develop new technologies.


The XC3S1000-5FT256I chip model is also suitable for use in networks and intelligent scenarios. It is capable of processing large amounts of data quickly and efficiently, making it ideal for use in the era of fully intelligent systems. The chip model can be used in a variety of applications, including autonomous vehicles, smart homes, and smart cities.


Overall, the XC3S1000-5FT256I chip model is an excellent choice for those who require high performance and low power consumption. Its features make it suitable for use in a variety of industries and applications, and its expected demand in the future suggests that it will remain a popular choice for many years to come. Furthermore, its potential for use in advanced communication systems and intelligent scenarios makes it an ideal choice for the era of fully intelligent systems.



2,018 In Stock


I want to buy

Unit Price: $109.3716
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $101.7156 $101.7156
10+ $100.6219 $1,006.2187
100+ $95.1533 $9,515.3292
1000+ $89.6847 $44,842.3560
10000+ $82.0287 $82,028.7000
The price is for reference only, please refer to the actual quotation!

Quick Quote