
AMD Xilinx
XC3S1000-5FG676I
XC3S1000-5FG676I ECAD Model
XC3S1000-5FG676I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 391 | |
Number of Outputs | 391 | |
Number of Logic Cells | 17280 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC3S1000-5FG676I Datasheet Download
XC3S1000-5FG676I Overview
The XC3S1000-5FG676I chip model is a powerful, high-performance digital signal processing (DSP) solution, designed to meet the needs of embedded processing and image processing applications. It is an ideal choice for developers who are looking for a reliable and efficient solution to their product needs.
The XC3S1000-5FG676I chip model is based on a Xilinx Spartan-3E FPGA architecture, which provides a high-speed, low-power, and highly-flexible platform for digital signal processing. It is equipped with a range of features, including a configurable logic block, high-speed serial interface, and dedicated DSP blocks. This makes it a great choice for embedded applications that require high-performance DSP.
The XC3S1000-5FG676I chip model has a number of advantages, such as its low power consumption, high-speed performance, and flexibility. It also offers a wide range of features, such as configurable logic blocks, high-speed serial interface, and dedicated DSP blocks. These features make it an ideal choice for developers who need a reliable and efficient solution for their product needs.
The demand for the XC3S1000-5FG676I chip model is expected to increase in the future, as more and more applications require high-performance DSP solutions. This is especially true in the fields of artificial intelligence, machine learning, and robotics, which are becoming increasingly popular.
The XC3S1000-5FG676I chip model can be applied to the development and popularization of future intelligent robots. It is a powerful, high-performance DSP solution that can handle complex tasks, such as image processing and machine learning. To use the model effectively, developers need to be familiar with the HDL language, as well as the Xilinx Spartan-3E FPGA architecture. They also need to have a good understanding of the features and capabilities of the XC3S1000-5FG676I chip model, in order to make the most of its potential.
In conclusion, the XC3S1000-5FG676I chip model is a powerful, high-performance DSP solution, designed to meet the needs of embedded processing and image processing applications. It is an ideal choice for developers who are looking for a reliable and efficient solution to their product needs. The demand for the XC3S1000-5FG676I chip model is expected to increase in the future, as more and more applications require high-performance DSP solutions. It can also be applied to the development and popularization of future intelligent robots, but developers need to be familiar with the HDL language, as well as the Xilinx Spartan-3E FPGA architecture in order to use the model effectively.
1,412 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $186.0651 | $186.0651 |
10+ | $184.0644 | $1,840.6440 |
100+ | $174.0609 | $17,406.0900 |
1000+ | $164.0574 | $82,028.7000 |
10000+ | $150.0525 | $150,052.5000 |
The price is for reference only, please refer to the actual quotation! |