XC3S1000-5FG676I
XC3S1000-5FG676I
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rohs

AMD Xilinx

XC3S1000-5FG676I


XC3S1000-5FG676I
F20-XC3S1000-5FG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC3S1000-5FG676I ECAD Model


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XC3S1000-5FG676I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 391
Number of Outputs 391
Number of Logic Cells 17280
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Power Supplies 1.2,1.2/3.3,2.5 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC3S1000-5FG676I Datasheet Download


XC3S1000-5FG676I Overview



The XC3S1000-5FG676I chip model is a powerful, high-performance digital signal processing (DSP) solution, designed to meet the needs of embedded processing and image processing applications. It is an ideal choice for developers who are looking for a reliable and efficient solution to their product needs.


The XC3S1000-5FG676I chip model is based on a Xilinx Spartan-3E FPGA architecture, which provides a high-speed, low-power, and highly-flexible platform for digital signal processing. It is equipped with a range of features, including a configurable logic block, high-speed serial interface, and dedicated DSP blocks. This makes it a great choice for embedded applications that require high-performance DSP.


The XC3S1000-5FG676I chip model has a number of advantages, such as its low power consumption, high-speed performance, and flexibility. It also offers a wide range of features, such as configurable logic blocks, high-speed serial interface, and dedicated DSP blocks. These features make it an ideal choice for developers who need a reliable and efficient solution for their product needs.


The demand for the XC3S1000-5FG676I chip model is expected to increase in the future, as more and more applications require high-performance DSP solutions. This is especially true in the fields of artificial intelligence, machine learning, and robotics, which are becoming increasingly popular.


The XC3S1000-5FG676I chip model can be applied to the development and popularization of future intelligent robots. It is a powerful, high-performance DSP solution that can handle complex tasks, such as image processing and machine learning. To use the model effectively, developers need to be familiar with the HDL language, as well as the Xilinx Spartan-3E FPGA architecture. They also need to have a good understanding of the features and capabilities of the XC3S1000-5FG676I chip model, in order to make the most of its potential.


In conclusion, the XC3S1000-5FG676I chip model is a powerful, high-performance DSP solution, designed to meet the needs of embedded processing and image processing applications. It is an ideal choice for developers who are looking for a reliable and efficient solution to their product needs. The demand for the XC3S1000-5FG676I chip model is expected to increase in the future, as more and more applications require high-performance DSP solutions. It can also be applied to the development and popularization of future intelligent robots, but developers need to be familiar with the HDL language, as well as the Xilinx Spartan-3E FPGA architecture in order to use the model effectively.



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Unit Price: $200.07
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $186.0651 $186.0651
10+ $184.0644 $1,840.6440
100+ $174.0609 $17,406.0900
1000+ $164.0574 $82,028.7000
10000+ $150.0525 $150,052.5000
The price is for reference only, please refer to the actual quotation!

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